w83627sf Winbond Electronics Corp America, w83627sf Datasheet - Page 29

• Manufacturer Part Number: w83627sf
• Description: Winbond I/o
• Manufacturer: Winbond Electronics Corp America

2. LPC (LOW PIN COUNT) INTERFACE
LPC interface is to replace ISA interface serving as a bus interface between host (chip-set) and
peripheral (Winbond I/O). Data transfer on the LPC bus are serialized over a 4 bit bus. The general
characteristics of the interface implemented in Winbond LPC I/O are:
Comparing to its ISA counterpart, LPC implementation saves up to 40 pin counts (see table below) free
for integrating more devices on a single chip.
Winbond I/O
The transition from ISA to LPC is transparent in terms of software which means no BIOS or device driver
update is needed except chip-specific configuration.
W83977EF
W83627SF
One control line, namely LFRAME#, which is used by the host to start or stop transfers.
peripherals drive this signal.
The LAD[3:0] bus, which communicates information serially. The information conveyed are cycle
type, cycle direction, chip selection, address, data, and wait states.
MR (master reset) of Winbond ISA I/O is replaced with a active low reset signal, namely LRESET#, in
Winbond LPC I/O.
An additional 33 MHz PCI clock is needed in Winbond LPC I/O for synchronization.
DMA requests are issued through LDRQ#.
Interrupt requests are issued through SERIRQ.
Power management events are issued through PME#.
save
D[7:0], SA[15:0], DRQ[3:0], DACK#[3:0], TC, IOR#, IOW#, IOCHRDY, IRQs
LAD[3:0], LFRAME#, PCICLK, LDRQ#, SERIRQ, PME#
Interface pins
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Publication Release Date: Nov. 2000
PRELIMINARY
W83627SF
Revision 0.60
count
49
40
9
No