mpc7450 Freescale Semiconductor, Inc, mpc7450 Datasheet - Page 44

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mpc7450

Manufacturer Part Number
mpc7450
Description
Mpc7450 Risc Microprocessor
Manufacturer
Freescale Semiconductor, Inc
Datasheet
System Design Information
sinks may be attached to the package by several methods—spring clip to holes in the printed-circuit board
or package, and mounting clip and screw assembly (see Figure 24); however, due to the potential large mass
of the heat sink, attachment through the printed circuit board is suggested. If a spring clip is used, the spring
force should not exceed 5.5 pounds.
The board designer can choose between several types of heat sinks to place on the MPC7450. There are
several commercially available heat sinks for the MPC7450 provided by the following vendors:
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Chip Coolers Inc.
333 Strawberry Field Rd.
Warwick, RI 02887-6979
Internet: www.chipcoolers.com
International Electronic Research Corporation (IERC)
135 W. Magnolia Blvd.
Burbank, CA 91502
Internet: www.ctscorp.com
Thermalloy
2021 W. Valley View Lane
Dallas, TX 75234-8993
Internet: www.thermalloy.com
Wakefield Engineering
100 Cummings Center, Suite 157H
Beverly, MA 01915
Internet: www.wakefield.com
Aavid Engineering
250 Apache Trail
Terrell, TX 75160
Internet: www.aavid.com
Figure 24. Package Exploded Cross-Sectional View with Several Heat Sink Options
Thermal Interface Material
MPC7450 RISC Microprocessor Hardware Specifications
Freescale Semiconductor, Inc.
For More Information On This Product,
Heat Sink
Heat Sink
Go to: www.freescale.com
Clip
Printed-Circuit Board
x x x x x x x x
x x x x x x x x
CBGA Package
800-227-0254 (USA/Canada)
401-739-7600
818-842-7277
972-243-4321
781-406-3000
972-551-7330
MOTOROLA

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