mpc7450 Freescale Semiconductor, Inc, mpc7450 Datasheet - Page 43

• Manufacturer Part Number: mpc7450
• Description: Mpc7450 Risc Microprocessor
• Manufacturer: Freescale Semiconductor, Inc

1.9.9
This section provides thermal management information for the ceramic ball grid array (CBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level
design—the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat
MOTOROLA
COP Connector
Physical Pin Out
Notes:
1. RUN/STOP, normally found on pin 5 of the COP header, is not implemented on the MPC7450.
2. Key location; Pin 14 is not physically present on the COP header.
3. Component not populated. Populate only if JTAG interface is unused.
4. Component not populated. Populate only if debug tool does not drive QACK.
5. Populate only if debug tool uses an open-drain type output and does not actively deassert QACK.
Connect pin 5 of the COP header to OV
.
Thermal Management Information
13
15
11
1
1
3
5
7
9
Board Sources
No pin
KEY
From Target
10
12
16
2
4
6
8
(if any)
MPC7450 RISC Microprocessor Hardware Specifications
Freescale Semiconductor, Inc.
Key
For More Information On This Product,
SRESET
HRESET
Figure 23. JTAG Interface Connection
QACK
15
14
11
12
13
10
16
5
4
6
2
1
3
7
8
9
1
2
CHKSTP_OUT
CHKSTP_IN
VDD_SENSE
TMS
TDO
TDI
TCK
QACK
Go to: www.freescale.com
SRESET
TRST
HRESET
NC
NC
DD
with a 10 K
2 k
2 k
pull-up resistor.
10 k
2 k
10 k
10 k
5
10 k
10 k
10 k
10 k
10 k
2 k
System Design Information
3
TDO
OV
OV
OV
OV
GND
OV
CHKSTP_OUT
OV
CHKSTP_IN
TMS
TDI
TCK
HRESET
OV
OV
TRST
QACK
SRESET
OV
DD
DD
DD
DD
DD
DD
DD
DD
DD
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