PTN3700EV/G,118 NXP Semiconductors, PTN3700EV/G,118 Datasheet - Page 41

• Manufacturer Part Number: PTN3700EV/G,118
• Description: IC MOBILE INTERFACE 56-VFBGA
• Manufacturer: NXP Semiconductors
• Type: Interfacer
• Series: -r

Specifications of PTN3700EV/G,118

• Package / Case: 56-VFBGA
• Applications: Mobile Phones, Cellular, Video Displays
• Mounting Type: Surface Mount
• Input Current: 4 uA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 1.8 V
• Supply Voltage (max): 1.95 V
• Supply Voltage (min): 1.65 V
• Number Of Outputs: 4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935284074118; PTN3700EV/G-T; PTN3700EV/G-T

NXP Semiconductors
20. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.4.1
7.4.2
7.4.3
7.4.3.1
7.4.3.2
7.4.4
7.4.4.1
7.4.4.2
7.5
7.6
7.7
7.8
8
9
10
11
11.1
11.2
11.3
11.3.1
11.3.2
11.4
12
12.1
12.2
12.3
12.4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 20
Recommended operating conditions. . . . . . . 20
Static characteristics. . . . . . . . . . . . . . . . . . . . 21
Dynamic characteristics . . . . . . . . . . . . . . . . . 23
Application information. . . . . . . . . . . . . . . . . . 30
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Link programmability. . . . . . . . . . . . . . . . . . . . 10
Versatile signal mirroring programmability . . . 10
High-speed data channel protocol options . . . 12
Serial protocol bit mapping - pseudo source
synchronous mode (FSS = LOW). . . . . . . . . . 13
Serial protocol bit mapping - fully source
synchronous mode (FSS = HIGH) . . . . . . . . . 14
PLL, PCLK, CLK and pixel synchronization . . 15
Pixel synchronization . . . . . . . . . . . . . . . . . . . 15
PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
HS, VS and DE signal usage in various
PTN3700 modes. . . . . . . . . . . . . . . . . . . . . . . 15
PSS mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
FSS mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Power modes . . . . . . . . . . . . . . . . . . . . . . . . . 17
Link error detection and correction . . . . . . . . . 18
Frame Mixing and Advanced Frame Mixing . . 19
Auxiliary signals . . . . . . . . . . . . . . . . . . . . . . . 20
Transmitter mode . . . . . . . . . . . . . . . . . . . . . . 23
Receiver mode . . . . . . . . . . . . . . . . . . . . . . . . 24
Power-on/power-off sequence . . . . . . . . . . . . 26
Power-on sequence . . . . . . . . . . . . . . . . . . . . 26
Power-off sequence . . . . . . . . . . . . . . . . . . . . 27
High-speed signaling channel. . . . . . . . . . . . . 28
Typical lane and PCLK configurations . . . . . . 30
Pin configurations for various topologies of
PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Power decoupling configuration . . . . . . . . . . . 32
PCB/Flex layout guideline. . . . . . . . . . . . . . . . 32
13
13.1
14
15
15.1
15.2
15.3
15.4
16
17
18
18.1
18.2
18.3
18.4
19
20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Test information. . . . . . . . . . . . . . . . . . . . . . . . 33
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 35
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 38
Revision history . . . . . . . . . . . . . . . . . . . . . . . 39
Legal information . . . . . . . . . . . . . . . . . . . . . . 40
Contact information . . . . . . . . . . . . . . . . . . . . 40
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
1.8 V simple mobile interface link bridge IC
High-speed signaling channel measurements 33
Introduction to soldering. . . . . . . . . . . . . . . . . 36
Wave and reflow soldering . . . . . . . . . . . . . . . 36
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 36
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 37
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 40
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Document identifier: PTN3700_1
Date of release: 14 August 2007
PTN3700
All rights reserved.