KMPC8548EVTAUJC Freescale Semiconductor, KMPC8548EVTAUJC Datasheet - Page 88

• Manufacturer Part Number: KMPC8548EVTAUJC
• Manufacturer: Freescale Semiconductor

Specifications of KMPC8548EVTAUJC

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Package Description
88
LID CHAMFER
A1 CORNER
4X
Figure 55. Mechanical Dimensions and Bottom Surface Nomenclature of the HiCTE
0.2
Notes:
1. All d
2. Dimensioning and tolerancing per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
6. All dimensions are symmetric across the package center lines unless dimensioned otherwise.
7. Package code summary:
AB
AF
AD
AH
Y
V
T
P
M
K
H
F
D
B
•PBGA 8423
•CBGA 5112
AG
AE
AC
AA
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 7
W
U
L
E
R
N
J
G
C
A
imensions are in millimeters.
1
2
3
4
5
6
7 9
8 10 12 14 16 18 20 22
0.5
BOTTOM VIEW
TOP VIEW
28.7 MAX
LID ZONE
11 13 15 17 19 21 23
29
FC-CBGA and FC-PBGA with Full Lid
27X 1
24 26 28
25 27
27X 1
28.7 MAX
LID ZONE
B
783X
0.5
0.3
0.15 A
M
0.5
0.7
29
C
A B C
3
783X
MAX
3.38
1.63
1.37
0.35 A
5
Freescale Semiconductor
0.25 A
0.2 A
SIDE VIEW
SEATING
PLANE
1.32
1.08
0.6
0.35
A
4