MT48LC16M16A2P-75:DTR Micron Technology Inc, MT48LC16M16A2P-75:DTR Datasheet - Page 19

• Manufacturer Part Number: MT48LC16M16A2P-75:DTR
• Manufacturer: Micron Technology Inc

Specifications of MT48LC16M16A2P-75:DTR

• Lead Free Status / Rohs Status: Compliant

Table 6: Thermal Impedance Simulated Values
Figure 10: Example: Temperature Test Point Location, 54-Pin TSOP (Top View)
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
Revision
Die
D
54-ball VFBGA
Test point
60-ball FBGA
54-pin TSOP
Package
Notes:
Substrate
1. For designs expected to last beyond the die revision listed, contact Micron Applications
2. Thermal resistance data is sampled from multiple lots, and the values should be viewed
3. These are estimates; actual results may vary.
2-layer
4-layer
2-layer
4-layer
2-layer
4-layer
Engineering to confirm thermal impedance values.
as typical.
11.11mm
Θ JA (°C/W)
Airflow =
0m/s
64.9
51.5
40.9
81
44
67
22.22mm
19
Θ JA (°C/W)
Airflow =
Temperature and Thermal Impedance
1m/s
63.8
47.3
50.8
41.6
51.2
35.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Θ JA (°C/W)
Airflow =
256Mb: x4, x8, x16 SDRAM
2m/s
57.6
44.5
44.8
38.1
47.8
32.2
5.08mm
© 1999 Micron Technology, Inc. All rights reserved.
Θ JB (°C/W) Θ JC (°C/W)
10.16mm
45.3
39.1
31.4
31.4
19.7
18.6
10.3
3.2
6.7