MT48H8M32LFB5-75 L:G Micron Technology Inc, MT48H8M32LFB5-75 L:G Datasheet - Page 65

MT48H8M32LFB5-75 L:G

Manufacturer Part Number
MT48H8M32LFB5-75 L:G
Description
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr
Datasheet

Specifications of MT48H8M32LFB5-75 L:G

Organization
8Mx32
Density
256Mb
Address Bus
14b
Access Time (max)
8/6ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
100mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
Figure 35: READ With Auto Precharge Interrupted by a READ
PDF: 09005aef834c13d2
256mb_mobile_sdram_y36n.pdf - Rev. I 11/09 EN
Internal
states
Command
Note:
Address
Bank m
Bank n
CLK
DQ
WRITE with auto precharge interrupted by a WRITE (with or without auto precharge)
A WRITE to bank m will interrupt a WRITE on bank n when registered. The precharge to
bank n will begin after
registered. The last valid data WRITE to bank n will be data registered one clock prior to
a WRITE to bank m (see Figure 42 (page 71)).
1. DQM is LOW.
Page active
NOP
T0
READ - AP
Page active
Bank n,
Bank n
T1
Col a
READ with burst of 4
256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
t
WR is met, where
T2
CL = 3 (bank n)
NOP
65
READ - AP
Bank m,
T3
Bank m
Col d
Interrupt burst, precharge
READ with burst of 4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t
T4
WR begins when the WRITE to bank m is
CL = 3 (bank m)
NOP
t
RP - bank n
D
OUT
T5
NOP
D
OUT
PRECHARGE Operation
T6
NOP
D
©2008 Micron Technology, Inc. All rights reserved.
OUT
Idle
T7
Don’t Care
NOP
t RP - bank m
D
Precharge
OUT

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