GCIXP1250BA 837411 Intel, GCIXP1250BA 837411 Datasheet - Page 70

• Manufacturer Part Number: GCIXP1250BA 837411
• Manufacturer: Intel

Specifications of GCIXP1250BA 837411

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Intel
Table 34.
1. A load is defined as input capacitance equivalent to a CMOS gate + minimal trace length capacitance, typically 8 pF. The customer is responsible
70
SDRAM Bus
SRAM Bus
IX Bus
for managing the signal integrity and external power issues that occur with increased IXP1200 Bus loading in their application to ensure reliable sys-
tem operation.
Figure 12. Typical IXP1250 Heatsink Application
®
IXP1250 Network Processor
Note: The heat sink comparison shown in
Note: Refer to the IXP1250 Network Processor Heatsinks: ja and Airflow - Application Note for
8
8
7
Maximum Power
166 MHz/66 MHz
Maximum and Typical Bus Loading Used for the Power Calculations
package mounted on a 4 inch-by-4 inch test board.
additional information on heatsinks and thermal management.
Temperature)
(Commercial
IX Bus Freq
Core Freq/
Load for
12.5
10.0
7.5
5.0
2.5
0
5
5
4
Maximum Power
166 MHz/66 MHz
100
Temperature)
IX Bus Freq
Core Freq/
(Extended
Load for
200
Figure 12
8
8
4
300
Maximum Power
200 MHz/85 MHz
Temperature)
(Commercial
IX Bus Freq
Core Freq/
Load for
was tested on an IXP1250 Network Processor
Airflow
(LFM)
400
5
5
1
500
232 MHz/104 MHz
Maximum Power
Temperature)
(Commercial
IX Bus Freq
Core Freq/
Load for
600
1.10" Tall HS
Fan HS
Bare Package
0.5" Tall HS
0.745" Tall
700
Typical Power Load
5
5
2
1
Temperature)
(Commercial
Frequency
for IX Bus
Datasheet
85 MHz
800
A8541-01