MT41J64M16LA-15E IT:B Micron Technology Inc, MT41J64M16LA-15E IT:B Datasheet - Page 4

• Manufacturer Part Number: MT41J64M16LA-15E IT:B
• Manufacturer: Micron Technology Inc
• Type: DDR3 SDRAMr

Specifications of MT41J64M16LA-15E IT:B

• Organization: 64Mx16
• Density: 1Gb
• Address Bus: 16b
• Maximum Clock Rate: 1.333GHz
• Operating Supply Voltage (typ): 1.5V
• Package Type: FBGA
• Operating Temp Range: -40C to 95C
• Operating Supply Voltage (max): 1.575V
• Operating Supply Voltage (min): 1.425V
• Supply Current: 355mA
• Pin Count: 96
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Input Clock Frequency Change ...................................................................................................................... 121
Write Leveling ............................................................................................................................................... 123
Initialization ................................................................................................................................................. 128
Mode Registers .............................................................................................................................................. 130
Mode Register 0 (MR0) .................................................................................................................................. 131
Mode Register 1 (MR1) .................................................................................................................................. 135
Mode Register 2 (MR2) .................................................................................................................................. 138
Mode Register 3 (MR3) .................................................................................................................................. 141
MODE REGISTER SET (MRS) Command ........................................................................................................ 149
ZQ CALIBRATION Operation ......................................................................................................................... 150
ACTIVATE Operation ..................................................................................................................................... 151
READ Operation ............................................................................................................................................ 153
WRITE Operation .......................................................................................................................................... 164
PRECHARGE Operation ................................................................................................................................. 174
SELF REFRESH Operation ............................................................................................................................. 174
Extended Temperature Usage ........................................................................................................................ 176
Power-Down Mode ....................................................................................................................................... 177
RESET Operation ........................................................................................................................................... 185
On-Die Termination (ODT) ........................................................................................................................... 187
Dynamic ODT ............................................................................................................................................... 189
Synchronous ODT Mode ............................................................................................................................... 194
PDF: 09005aef826aa906
1Gb_DDR3_SDRAM.pdf – Rev. J 05/10 EN
DLL Disable Mode ..................................................................................................................................... 117
Write Leveling Procedure ........................................................................................................................... 125
Write Leveling Mode Exit Procedure ........................................................................................................... 127
Burst Length ............................................................................................................................................. 131
Burst Type ................................................................................................................................................ 132
DLL RESET ................................................................................................................................................ 133
Write Recovery .......................................................................................................................................... 133
Precharge Power-Down (Precharge PD) ..................................................................................................... 134
CAS Latency (CL) ....................................................................................................................................... 134
DLL Enable/DLL Disable ........................................................................................................................... 135
Output Drive Strength ............................................................................................................................... 136
OUTPUT ENABLE/DISABLE ...................................................................................................................... 136
TDQS Enable ............................................................................................................................................. 136
On-Die Termination .................................................................................................................................. 137
WRITE LEVELING ..................................................................................................................................... 137
POSTED CAS ADDITIVE Latency ................................................................................................................ 137
CAS Write Latency (CWL) ........................................................................................................................... 139
AUTO SELF REFRESH (ASR) ...................................................................................................................... 139
SELF REFRESH TEMPERATURE (SRT) ....................................................................................................... 140
SRT vs. ASR ............................................................................................................................................... 140
DYNAMIC ODT ......................................................................................................................................... 140
MULTIPURPOSE REGISTER (MPR) ............................................................................................................ 141
MPR Functional Description ...................................................................................................................... 142
MPR Register Address Definitions and Bursting Order ................................................................................ 143
MPR Read Predefined Pattern .................................................................................................................... 149
DQ Input Timing ....................................................................................................................................... 172
Functional Representation of ODT ............................................................................................................. 187
Nominal ODT ........................................................................................................................................... 187
Functional Description .............................................................................................................................. 189
ODT Latency and Posted ODT ................................................................................................................... 194
Timing Parameters .................................................................................................................................... 194
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb: x4, x8, x16 DDR3 SDRAM
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