MT41J64M16LA-15E IT:B Micron Technology Inc, MT41J64M16LA-15E IT:B Datasheet - Page 22

• Manufacturer Part Number: MT41J64M16LA-15E IT:B
• Manufacturer: Micron Technology Inc
• Type: DDR3 SDRAMr

Specifications of MT41J64M16LA-15E IT:B

• Organization: 64Mx16
• Density: 1Gb
• Address Bus: 16b
• Maximum Clock Rate: 1.333GHz
• Operating Supply Voltage (typ): 1.5V
• Package Type: FBGA
• Operating Temp Range: -40C to 95C
• Operating Supply Voltage (max): 1.575V
• Operating Supply Voltage (min): 1.425V
• Supply Current: 355mA
• Pin Count: 96
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Table 4: 86-Ball FBGA – x4, x8 Ball Descriptions (Continued)
PDF: 09005aef826aa906
1Gb_DDR3_SDRAM.pdf – Rev. J 05/10 EN
DQ0, DQ1, DQ2,
DQ3, DQ4, DQ5,
TDQS, TDQS#
DQS, DQS#
DQ6, DQ7
Symbol
V
V
V
V
V
REFDQ
REFCA
V
ZQ
NC
NF
DDQ
SSQ
DD
SS
Reference
Output
Supply
Supply
Supply
Supply
Supply
Supply
Type
I/O
I/O
–
–
Description
Data input/output: Bidirectional data bus for the x8 configuration. DQ[7:0] are
referenced to V
Data strobe: Output with read data. Edge-aligned with read data. Input with write
data. Center-aligned to write data.
Termination data strobe: Applies to the x8 configuration only. When TDQS is
enabled, DM is disabled, and the TDQS and TDQS# balls provide termination resistance.
Power supply: 1.5V ±0.075V.
DQ power supply: 1.5V ±0.075V. Isolated on the device for improved noise immunity.
Reference voltage for control, command, and address: V
maintained at all times (including self refresh) for proper device operation.
Reference voltage for data: V
refresh) for proper device operation.
Ground.
DQ ground: Isolated on the device for improved noise immunity.
External reference ball for output drive calibration: This ball is tied to an
external 240Ω resistor (RZQ), which is tied to V
No connect: These balls should be left unconnected (the ball has no connection to
the DRAM or to other balls).
No function: When configured as a x4 device, these balls are NF. When configured
as a x8 device, these balls are defined as TDQS#, DQ[7:4].
REFDQ
.
22
REFDQ
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Ball Assignments and Descriptions
must be maintained at all times (excluding self
1Gb: x4, x8, x16 DDR3 SDRAM
SSQ
.
© 2006 Micron Technology, Inc. All rights reserved.
REFCA
must be