PIC18F6410-I/PT Microchip Technology, PIC18F6410-I/PT Datasheet - Page 6

• Manufacturer Part Number: PIC18F6410-I/PT
• Description: IC PIC MCU FLASH 8KX16 64TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F6410-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 16KB (8K x 16)
• Package / Case: 64-TFQFP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 54
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: SPI/I2C/EUSART/AUSART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 54
• Number Of Timers: 4
• Operating Supply Voltage: 4.2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12-ch x 10-bit
• Package: 64TQFP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F6310/6410/8310/8410
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Interrupts .................................................................................................................................................................................. 109
11.0 I/O Ports ................................................................................................................................................................................... 125
12.0 Timer0 Module ......................................................................................................................................................................... 151
13.0 Timer1 Module ......................................................................................................................................................................... 155
14.0 Timer2 Module ......................................................................................................................................................................... 161
15.0 Timer3 Module ......................................................................................................................................................................... 163
16.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 167
17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 177
18.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 217
19.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (AUSART) ........................................................... 241
20.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 255
21.0 Comparator Module.................................................................................................................................................................. 265
22.0 Comparator Voltage Reference Module ................................................................................................................................... 271
23.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 275
24.0 Special Features of the CPU .................................................................................................................................................... 281
25.0 Instruction Set Summary .......................................................................................................................................................... 297
26.0 Development Support............................................................................................................................................................... 347
27.0 Electrical Characteristics .......................................................................................................................................................... 351
28.0 Packaging Information.............................................................................................................................................................. 389
Appendix A: Revision History............................................................................................................................................................. 395
Appendix B: Device Differences......................................................................................................................................................... 395
Appendix C: Conversion Considerations ........................................................................................................................................... 396
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 396
Appendix E: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 397
Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................. 397
Index .................................................................................................................................................................................................. 399
The Microchip Web Site ..................................................................................................................................................................... 409
Customer Change Notification Service .............................................................................................................................................. 409
Customer Support .............................................................................................................................................................................. 409
Reader Response .............................................................................................................................................................................. 410
PIC18F6310/6410/8310/8410 Product Identification System ............................................................................................................ 411
DS39635C-page 6
Device Overview .......................................................................................................................................................................... 9
Guidelines for Getting Started with PIC18F Microcontrollers ..................................................................................................... 31
Oscillator Configurations ............................................................................................................................................................ 35
Power-Managed Modes ............................................................................................................................................................. 45
Reset .......................................................................................................................................................................................... 55
Memory Organization ................................................................................................................................................................. 67
Program Memory........................................................................................................................................................................ 89
External Memory Interface ......................................................................................................................................................... 95
8 x 8 Hardware Multiplier.......................................................................................................................................................... 107
 2010 Microchip Technology Inc.