C8051F540-TB Silicon Laboratories Inc, C8051F540-TB Datasheet - Page 26
![BOARD PROTOTYPE W/C8051F540](/photos/9/25/92559/c8051f540-tb_sml.jpg)
C8051F540-TB
Manufacturer Part Number
C8051F540-TB
Description
BOARD PROTOTYPE W/C8051F540
Manufacturer
Silicon Laboratories Inc
Type
MCUr
Specifications of C8051F540-TB
Contents
Board
Processor To Be Evaluated
C8051F54x
Processor Series
C8051F54x
Interface Type
USB
Operating Supply Voltage
5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
C8051F54x
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1672
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C8051F54x
26
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A 3x3 array of 1.0 mm openings on a 1.20 mm pitch should be used for the center ground pad.
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Dimension
metal pad is to be 60 m minimum, all the way around the pad.
good solder paste release.
Components.
C1
C2
X1
e
Table 4.4. QFN-32 Landing Diagram Dimensions
4.80
4.80
0.20
Min
Figure 4.4. QFN-32 Landing Diagram
0.50 BSC
Max
4.90
4.90
0.30
Rev. 1.1
Dimension
X2
Y1
Y2
3.20
0.75
3.20
Min
Max
3.40
0.85
3.40
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