ST7MDT2-EPB2/US STMicroelectronics, ST7MDT2-EPB2/US Datasheet - Page 143

no-image

ST7MDT2-EPB2/US

Manufacturer Part Number
ST7MDT2-EPB2/US
Description
BOARD PROGRAMMING SGL POS ST7
Manufacturer
STMicroelectronics
Type
MCUr
Datasheets

Specifications of ST7MDT2-EPB2/US

Contents
Programmer Board
For Use With/related Products
ST72311, ST72124, ST72314, ST72334
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
17.2 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only
as design guidelines in
Figure 105. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
Figure 106. Recommended Reflow Soldering Oven Profile (MID JEDEC)
Temp. [°C]
Temp. [°C]
250
200
150
100
250
200
150
100
50
50
0
0
PREHEATING
PHASE
Figure 105
ramp up
2°C/sec for 50sec
20
90 sec at 125°C
80°C
and
100
40
Figure
SOLDERING
PHASE
106.
60
5 sec
200
150 sec above 183°C
80
Recommended glue for SMD plastic packages
dedicated to molding compound with silicone:
Heraeus: PD945, PD955
Loctite: 3615, 3298
ST72334J/N, ST72314J/N, ST72124J
100
ramp down natural
2°C/sec max
COOLING PHASE
(ROOM TEMPERATURE)
Tmax=220+/-5°C
for 25 sec
300
120
140
400
160
Time [sec]
Time [sec]
143/153

Related parts for ST7MDT2-EPB2/US