EVAL-ADUC7128QSPZ Analog Devices Inc, EVAL-ADUC7128QSPZ Datasheet - Page 91

• Manufacturer Part Number: EVAL-ADUC7128QSPZ
• Description: KIT DEV FOR ADUC7128
• Manufacturer: Analog Devices Inc
• Series: QuickStart™ PLUS Kitr
• Type: MCUr

Specifications of EVAL-ADUC7128QSPZ

• Contents: Evaluation Board, Power Supply, Cable, Software, Emulator and Documentation
• Silicon Manufacturer: Analog Devices
• Core Architecture: ARM
• Core Sub-architecture: ARM7TDMI
• Silicon Core Number: ADuC7128
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: ADuC7128
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

OUTLINE DIMENSIONS
1.00
0.85
0.80
SEATING
PLANE
12° MAX
PIN 1
INDICATOR
1.45
1.40
1.35
ROTATED 90° CCW
BSC SQ
9.00
VIEW
TOP
VIEW A
SEATING
PLANE
0.80 MAX
0.65 TYP
0.50 BSC
Figure 73. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
0.08
COPLANARITY
Figure 74. 64-Lead Low Profile Quad Flat Package [LQFP]
* COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
EXCEPT FOR EXPOSED PAD DIMENSION
0.20
0.09
BSC SQ
3.5°
COMPLIANT TO JEDEC STANDARDS MS-026-BCD
0°
7°
8.75
0.20 REF
0.75
0.60
0.45
0.05 MAX
0.02 NOM
9 mm × 9 mm Body, Very Thin Quad
0.60 MAX
Dimensions shown in millimeters
Dimensions shown in millimeters
0.50
0.40
0.30
Rev. 0 | Page 91 of 92
1.60
MAX
(CP-64-1)
VIEW A
(ST-64-2)
48
33
49
32
0.60 MAX
16
1
64
17
(BOTTOM VIEW)
EXPOSED PAD
LEAD PITCH
PIN 1
7.50
REF
BSC
0.50
(PINS DOWN)
TOP VIEW
12.20
12.00 SQ
11.80
0.30
0.25
0.18
17
64
16
1
THE EXPOSE PAD IS NOT CONNECTED
INTERNALLY. FOR INCREASED RELIABILITY
OF THE SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO
THE GROUND PLANE.
0.27
0.22
0.17
* 4.85
4.55
4.70 SQ
PIN 1
INDICATOR
49
32
48
33
ADuC7128/ADuC7129
10.20
10.00 SQ
9.80