C8051F700-TB Silicon Laboratories Inc, C8051F700-TB Datasheet - Page 42

• Manufacturer Part Number: C8051F700-TB
• Description: BOARD PROTOTYPE WITH C8051F700
• Manufacturer: Silicon Laboratories Inc

Specifications of C8051F700-TB

• Accessory Type: Target Board
• Processor To Be Evaluated: C8051F700
• Processor Series: C8051F7xx
• Interface Type: USB
• Operating Supply Voltage: 7 V to 15 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: C8051F7xx
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1637; C8051F700

C8051F70x/71x
42
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
9. A 3x3 array of 1.20 mm square openings on 1.40 mm pitch should be used for the center ground pad.
10. A No-Clean, Type-3 solder paste is recommended.
11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
based on a Fabrication Allowance of 0.05 mm.
to be 60 µm minimum, all the way around the pad.
paste release.
Dimension
C1
C2
X1
X2
Y1
Y2
e
Table 6.2. QFN-48 PCB Land Pattern Dimensions
Figure 6.2. QFN-48 PCB Land Pattern
Rev. 1.0
6.80
6.80
0.20
4.00
0.75
4.00
Min
0.50 BSC
Max
6.90
6.90
0.30
4.10
0.85
4.10