IDT88P8342BHGI IDT, Integrated Device Technology Inc, IDT88P8342BHGI Datasheet - Page 94

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IDT88P8342BHGI

Manufacturer Part Number
IDT88P8342BHGI
Description
IC SPI3-SPI4 EXCHANGE 820-PBGA
Manufacturer
IDT, Integrated Device Technology Inc
Datasheet

Specifications of IDT88P8342BHGI

Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
88P8342BHGI

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IDT88P8342BHGI
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
IDT88P8342 SPI EXCHANGE 2 x SPI-3 TO SPI-4
INDUSTRIAL TEMPERATURE RANGE
12.3 Device package
The SPI Exchange IDT88P8342 device is packaged in a 35 mm by 35 mm
820-ball one millimeter ball pitch thermally-enhanced plastic ball grid array. All
balls, whether used or unused, must be soldered to pads.
Figure 42. IDT88P8342 820PBGA package, bottom view
APRIL 10, 2006
94

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