AD8384ASVZ Analog Devices Inc, AD8384ASVZ Datasheet - Page 20

• Manufacturer Part Number: AD8384ASVZ
• Description: IC DRIVER LCD 6CH 10BIT 80-TQFP
• Manufacturer: Analog Devices Inc
• Series: DecDriver™r

Specifications of AD8384ASVZ

• Display Type: LCD
• Interface: 3-Wire Serial
• Current - Supply: 40mA
• Voltage - Supply: 9 V ~ 18 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Configuration: -
• Digits Or Characters: -

AD8384
AD8384 PCB DESIGN RECOMMENDATIONS
Top PCB Layer
Land Pattern Dimensions
Pad Size: 0.6 mm × 0.25 mm
Pad Pitch: 0.5 mm
Thermal Pad Size: 6 mm × 6 mm
Thermal via structure: 0.25 mm to 0.35 mm diameter via holes on
a 0.5 mm to 1.0 mm grid.
Bottom PCB Layer
Thermal Pad and Thermal Via Connections
The thermal pad on the solder side is connected to a plane. Use of
thermal spokes is not recommended when connecting the thermal
pads or via structure to the plane.
Solder Masking
Solder masking of the via holes on the top layer of the PCB plugs
the via holes, inhibiting solder flow into the holes. To minimize the
formation of solder voids due to solder flowing into the via holes
(solder wicking), the via diameter should be made small and an
optional solder mask may be used. To optimize thermal pad
coverage, the solder mask’s diameter should be no more than
0.1 mm larger than the via hole diameter.
Solder Mask—Top Layer
Pads: Set by the customer’s PCB design rules.
Thermal Via Holes: Circular mask, centered on the via holes.
Diameter of the mask should be 0.1 mm larger than the via hole
diameter.
Solder Mask—Bottom Layer
Set by customer’s PCB design rules.
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Figure 22. Land Pattern—Bottom Layer
Figure 21. Land Pattern—Top Layer
Figure 23. Solder Mask—Top Layer
LAND PATTERN – BOTTOM LAYER
SOLDER MASK – TOP LAYER
LAND PATTERN – TOP LAYER
6 mm
6 mm
14 mm