MT48H16M16LFBF-75:G TR Micron Technology Inc, MT48H16M16LFBF-75:G TR Datasheet - Page 74

• Manufacturer Part Number: MT48H16M16LFBF-75:G TR
• Description: IC SDRAM 256MBIT 132MHZ 54VFBGA
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H16M16LFBF-75:G TR

• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 256M (16Mx16)
• Speed: 132MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 54-VFBGA
• Organization: 16Mx16
• Density: 256Mb
• Address Bus: 15b
• Access Time (max): 8/6ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 80mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1326-2

Figure 54:
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although
PDF:09005aef8219eeeb/Source: 09005aef8219eedd
256mb_x16_sdram_y36m_1.fm - Rev G 6/09 EN
considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
Dimensions apply
to solder balls post-
reflow. Pre-reflow
balls are Ø0.42 on
Ø0.4 SMD ball pads.
Seating
plane
90X 0.45
0.1 A
11.2
0.8 TYP
5.6
90-Ball VFBGA (8mm x 13mm)
A
Notes: 1. All dimensions are in millimeters.
9
8
3.2
7
www.micron.com/productsupport Customer Comment Line: 800-932-4992
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
Micron and the Micron logo are trademarks of Micron Technology, Inc.
8 ±0.1
All other trademarks are the property of their respective owners.
6.4
Ball A1 ID
4 ±0.05
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
6.5 ±0.05
0.65 ±0.05
0.8 TYP
74
13 ±0.1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.0 MAX
256Mb: x16, x32 Mobile SDRAM
Solder ball material:
SAC105 (98.5% Sn, 1%Ag, 0.5% Cu)
Substrate material: plastic laminate
Mold compound: epoxy novolac
Package Dimensions
©2006 Micron Technology, Inc. All rights reserved.
Ball A1 ID