MT48H16M16LFBF-75:G TR Micron Technology Inc, MT48H16M16LFBF-75:G TR Datasheet - Page 73

• Manufacturer Part Number: MT48H16M16LFBF-75:G TR
• Description: IC SDRAM 256MBIT 132MHZ 54VFBGA
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H16M16LFBF-75:G TR

• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 256M (16Mx16)
• Speed: 132MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 54-VFBGA
• Organization: 16Mx16
• Density: 256Mb
• Address Bus: 15b
• Access Time (max): 8/6ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 80mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1326-2

Package Dimensions
Figure 53:
PDF:09005aef8219eeeb/Source: 09005aef8219eedd
256mb_x16_sdram_y36m_1.fm - Rev G 6/09 EN
CONDITION. THE PRE-
REFLOW DIAMETER
DIAMETER REFERS
TO POST REFLOW
IS 0.42 ON A 0.40
SMD BALL PAD.
6.40
SOLDER BALL
54X Ø0.45
SEATING
PLANE
BALL A9
0.10 A
54-Ball VFBGA (8mm x 9mm)
3.20
Notes: 1. All dimensions are in millimeters.
A
3.20
8.00 ±0.10
6.40
C L
0.80
TYP
4.00 ±0.05
C L
4.50 ±0.05
0.80 TYP
0.65 ±0.05
BALL A1
BALL A1 ID
73
9.00 ± 0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
256Mb: x16, x32 Mobile SDRAM
MOLD COMPOUND: EPOXY NOVOLAC
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL: PLASTIC LAMINATE
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
©2006 Micron Technology, Inc. All rights reserved.
MICRON LOGO
TO BE LASED
BALL A1 ID