MT48H16M16LFBF-75:G TR Micron Technology Inc, MT48H16M16LFBF-75:G TR Datasheet - Page 38

IC SDRAM 256MBIT 132MHZ 54VFBGA

MT48H16M16LFBF-75:G TR

Manufacturer Part Number
MT48H16M16LFBF-75:G TR
Description
IC SDRAM 256MBIT 132MHZ 54VFBGA
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr

Specifications of MT48H16M16LFBF-75:G TR

Format - Memory
RAM
Memory Type
Mobile SDRAM
Memory Size
256M (16Mx16)
Speed
132MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-VFBGA
Organization
16Mx16
Density
256Mb
Address Bus
15b
Access Time (max)
8/6ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
80mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
557-1326-2
Figure 30:
WRITE with Auto Precharge
PDF:09005aef8219eeeb/Source: 09005aef8219eedd
256mb_x16_sdram_y36m_1.fm - Rev G 6/09 EN
READ with Auto Precharge Interrupted by a WRITE
Internal
States
Note:
1. Interrupted by a READ (with or without auto precharge): A READ to bank m will inter-
2. Interrupted by a WRITE (with or without auto precharge): A WRITE to bank m will
COMMAND
rupt a WRITE on bank n when registered, with the data-out appearing CL later. The
precharge to bank n will begin after
bank m is registered. The last valid WRITE to bank n will be data-in registered one
clock prior to the READ to bank m (see Figure 31 on page 39).
interrupt a WRITE on bank n when registered. The precharge to bank n will begin
after
valid data WRITE to bank n will be data registered one clock prior to a WRITE to bank
m (see Figure 32 on page 39).
ADDRESS
BANK m
DQM is HIGH at T2 to prevent D
BANK n
DQM
CLK
DQ
t
WR is met, where
1
Active
Page
READ - AP
BANK n,
BANK n
COL a
T0
READ with Burst of 4
Page Active
T1
NOP
CL = 3 (bank n)
t
WR begins when the WRITE to bank m is registered. The last
T2
38
NOP
OUT
T3
D
a +1 from contending with D
NOP
OUT
a
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
WR is met, where
BANK m,
WRITE - AP
COL d
BANK m
T4
D
d
256Mb: x16, x32 Mobile SDRAM
IN
Interrupt Burst, Precharge
WRITE with Burst of 4
T5
d + 1
NOP
D
IN
t
RP - BANK n
t
WR begins when the READ to
T6
d + 2
NOP
D
IN
©2006 Micron Technology, Inc. All rights reserved.
IN
DON’T CARE
d at T4.
T7
t WR - BANK m
d + 3
NOP
D
IN
Write-Back
Idle
Operations

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