MT46H32M32LFCM-6:A TR Micron Technology Inc, MT46H32M32LFCM-6:A TR Datasheet - Page 69

• Manufacturer Part Number: MT46H32M32LFCM-6:A TR
• Description: IC DDR SDRAM 1GBIT 90VFBGA
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46H32M32LFCM-6:A TR

• Format - Memory: RAM
• Memory Type: Mobile DDR SDRAM
• Memory Size: 1G (32M x 32)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 90-VFBGA
• Organization: 32Mx32
• Density: 1Gb
• Address Bus: 13b
• Access Time (max): 6.5/5.5ns
• Maximum Clock Rate: 166MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 140mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1334-2

Figure 32: Data Input Timing
PDF: 09005aef82ce3074
1gb_ddr_mobile_sdram_t48m.pdf - Rev. K 07/09 EN
Notes:
Data for any WRITE burst can be truncated by a subsequent PRECHARGE command, as
shown in Figure 42 (page 78) and Figure 43 (page 79). Note that only the data-in
pairs that are registered prior to the
any subsequent data-in should be masked with DM, as shown in Figure 42 (page 78)
and Figure 43 (page 79). After the PRECHARGE command, a subsequent command to
the same bank cannot be issued until
DQS
DM
CK#
DQ
CK
1. WRITE command issued at T0.
2.
3.
4. For x16, LDQS controls the lower byte; UDQS controls the upper byte. For x32, DQS0 con-
5. For x16, LDM controls the lower byte; UDM controls the upper byte. For x32, DM0 con-
4
5
t
t
trols DQ[7:0], DQS1 controls DQ[15:8], DQS2 controls DQ[23:16], and DQS3 controls
DQ[31:24].
trols DQ[7:0], DM1 controls DQ[15:8], DM2 controls DQ[23:16], and DM3 controls
DQ[31:24].
DSH (MIN) generally occurs during
DSS (MIN) generally occurs during
t
WPRES
T0
t
1
DQSS
t DS
T1
D
IN
t
WPRE
t
DSH
t DH
69
T1n
2
t
Transitioning Data
t
DQSL
DSS
t
WR period are written to the internal array, and
3
t
T2
1Gb: x16, x32 Mobile LPDDR SDRAM
t
RP is met.
t
DQSS (MAX).
DQSS (MIN).
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t
t
DQSH
DSH
T2n
2
t
t
WPST
DSS
3
T3
Don’t Care
©2007 Micron Technology, Inc. All rights reserved.
WRITE Operation