MT46H32M32LFCM-6:A TR Micron Technology Inc, MT46H32M32LFCM-6:A TR Datasheet - Page 16

• Manufacturer Part Number: MT46H32M32LFCM-6:A TR
• Description: IC DDR SDRAM 1GBIT 90VFBGA
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46H32M32LFCM-6:A TR

• Format - Memory: RAM
• Memory Type: Mobile DDR SDRAM
• Memory Size: 1G (32M x 32)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 90-VFBGA
• Organization: 32Mx32
• Density: 1Gb
• Address Bus: 13b
• Access Time (max): 6.5/5.5ns
• Maximum Clock Rate: 166MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 140mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1334-2

Figure 7: 90-Ball VFBGA (10mm x 13mm)
PDF: 09005aef82ce3074
1gb_ddr_mobile_sdram_t48m.pdf - Rev. K 07/09 EN
Dimensions apply
to solder balls
post-reflow. The
pre-reflow balls
are Ø0.42 on Ø0.4
SMD ball pads.
11.2
Seating
90X Ø0.45
plane
0.1 A
0.8 TYP
5.6
Note:
A
9 8
1. All dimensions are in millimeters.
3.2
7
10 ±0.1
6.4
5 ±0.05
3 2
1
0.8 TYP
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
6.5 ±0.05
0.65 ±0.05
Ball A1 ID
16
13 ±0.1
1Gb: x16, x32 Mobile LPDDR SDRAM
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.0 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
©2007 Micron Technology, Inc. All rights reserved.
Ball A1 ID