P5010NXN1QMB Freescale Semiconductor, P5010NXN1QMB Datasheet - Page 83

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P5010NXN1QMB

Manufacturer Part Number
P5010NXN1QMB
Description
Processors - Application Specialized P5010 Ext Tmp NoEnc 1600/1200 r2.0
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of P5010NXN1QMB

Rohs
yes
This figure shows the MII transmit AC timing diagram.
This table provides the MII receive AC timing specifications.
This figure provides the AC test load for eTSEC.
Freescale Semiconductor
For recommended operating conditions, see
For recommended operating conditions, see
TX_CLK duty cycle
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
TX_CLK data clock rise (20%–80%)
TX_CLK data clock fall (80%–20%)
RX_CLK clock period 10 Mbps
RX_CLK clock period 100 Mbps
RX_CLK duty cycle
RXD[3:0], RX_DV, RX_ER setup time to RX_CLK
RXD[3:0], RX_DV, RX_ER hold time to RX_CLK
RX_CLK clock rise (20%-80%)
RX_CLK clock fall time (80%-20%)
Note: The frequency of RX_CLK should not exceed frequency of GTX_CLK125 by more than 300ppm.
TXD[3:0]
TX_CLK
TX_EN
TX_ER
P5020/P5010 QorIQ Integrated Processor Hardware Specifications, Rev. 0
Parameter
Parameter
Table 36. MII Transmit AC Timing Specifications (continued)
Output
Table 37. MII Receive AC Timing Specifications
Figure 16. MII Transmit AC Timing Diagram
t
MTXH
Table
Table
Figure 17. eTSEC AC Test Load
3.
3.
t
MTX
Z
0
= 50 Ω
t
t
t
MTKHDX
t
MRXH
MTXH/
MTXF
t
t
t
Symbol
Symbol
MRDXKH
MTKHDX
MRDVKH
t
t
t
t
MTXR
t
t
MRXR
MRXF
MTXF
MRX
MRX
/t
t
MTX
MRX
R
L
t
MTXR
= 50 Ω
399.96
39.996
10.0
10.0
Min
Min
1.0
1.0
1.0
1.0
35
35
0
LV
DD
Typ
Typ
400
40
/2
Electrical Characteristics
400.04
40.004
Max
Max
4.0
4.0
4.0
4.0
65
25
65
Unit
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
%
%
83

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