LPC11U35FHI33/501, NXP Semiconductors, LPC11U35FHI33/501, Datasheet - Page 66
LPC11U35FHI33/501,
Manufacturer Part Number
LPC11U35FHI33/501,
Description
ARM Microcontrollers - MCU 32-bit ARM Cortex-M0 64KB Flash 12KB SRAM
Manufacturer
NXP Semiconductors
Datasheet
1.LPC11U35FHI33501.pdf
(70 pages)
Specifications of LPC11U35FHI33/501,
Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC11U3x
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
64 KB
Data Ram Size
12 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
HVQFN-32
Mounting Style
SMD/SMT
Factory Pack Quantity
490
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NXP Semiconductors
LPC11U3X
Product data sheet
Fig 41. Reflow soldering for the LQFP64 package
Footprint information for reflow soldering of LQFP64 package
DIMENSIONS in mm
0.500
P1
0.560
P2
13.300 13.300 10.300 10.300
Hy
Ax
solder land
occupied area
Gy
Ay
C
Bx
By
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
P2
1.500
C
D2 (8×)
Rev. 1 — 20 April 2012
0.280
Generic footprint pattern
D1
0.400 10.500 10.500 13.550 13.550
P1
D2
Hx
Gx
Bx
Ax
Gx
(0.125)
Gy
32-bit ARM Cortex-M0 microcontroller
Hx
D1
Hy
By
LPC11U3x
© NXP B.V. 2012. All rights reserved.
Ay
sot314-2_fr
SOT314-2
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