LPC11U35FHI33/501, NXP Semiconductors, LPC11U35FHI33/501, Datasheet - Page 58
LPC11U35FHI33/501,
Manufacturer Part Number
LPC11U35FHI33/501,
Description
ARM Microcontrollers - MCU 32-bit ARM Cortex-M0 64KB Flash 12KB SRAM
Manufacturer
NXP Semiconductors
Datasheet
1.LPC11U35FHI33501.pdf
(70 pages)
Specifications of LPC11U35FHI33/501,
Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC11U3x
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
64 KB
Data Ram Size
12 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
HVQFN-32
Mounting Style
SMD/SMT
Factory Pack Quantity
490
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Fig 33. Package outline HVQFN33 (7 x 7 x 0.85 mm)
LPC11U3X
Product data sheet
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 x 7 x 0.85 mm
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
mm
Unit
Outline
version
max
nom
min
terminal 1
index area
terminal 1
index area
1.00
0.85
0.80
A
(1)
E
0.05
0.02
0.00
L
A
h
1
8
1
0.35
0.28
0.23
b
IEC
9
32
0.2
c
e
D
7.1
7.0
6.9
(1)
33
D
4.85
4.70
4.55
e
D
D
JEDEC
1
h
h
All information provided in this document is subject to legal disclaimers.
E
7.1
7.0
6.9
(1)
b
References
4.85
4.70
4.55
0
25
E
Rev. 1 — 20 April 2012
h
16
0.65 4.55
e
JEITA
17
24
- - -
w
v
scale
B
e
e
2.5
1
C
C
e
A
E
4.55
2
A
e
2
B
0.75
0.60
0.45
L
A
5 mm
A
0.1
v
1
32-bit ARM Cortex-M0 microcontroller
0.05
w
y
1
0.08
C
y
detail X
European
projection
0.1
y
1
C
LPC11U3x
X
y
© NXP B.V. 2012. All rights reserved.
Issue date
09-03-17
09-03-23
c
hvqfn33_po
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