LPC11U35FHI33/501, NXP Semiconductors, LPC11U35FHI33/501, Datasheet - Page 62

• Manufacturer Part Number: LPC11U35FHI33/501,
• Description: ARM Microcontrollers - MCU 32-bit ARM Cortex-M0 64KB Flash 12KB SRAM
• Manufacturer: NXP Semiconductors

Specifications of LPC11U35FHI33/501,

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC11U3x
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 64 KB
• Data Ram Size: 12 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 3.6 V
• Operating Temperature Range: - 40 C to + 85 C
• Package / Case: HVQFN-32
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 490

NXP Semiconductors
13. Soldering
LPC11U3X
Product data sheet
Fig 37. Reflow soldering for the HVQFN33 (5x5) package
Footprint information for reflow soldering of HVQFN33 package
Issue date
Dimensions in mm
0.5
P
solder land
solder paste
occupied area
5.95
Ax
11-11-15
11-11-20
5.95
Ay
4.25
Bx
see detail X
Hy
4.25
By
Gy
SLy
C
0.85
C
All information provided in this document is subject to legal disclaimers.
0.27
D
Rev. 1 — 20 April 2012
5.25
Gx
nSPx
5.25
Gy
SLx
Hx
Gx
Bx
Ax
6.2
Hx
D
nSPy
P
6.2
Hy
3.75
32-bit ARM Cortex-M0 microcontroller
SLx
By
3.75
SLy
Ay
nSPx
3
nSPy
detail X
LPC11U3x
3
© NXP B.V. 2012. All rights reserved.
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