LPC11U35FHI33/501, NXP Semiconductors, LPC11U35FHI33/501, Datasheet - Page 64

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LPC11U35FHI33/501,

Manufacturer Part Number
LPC11U35FHI33/501,
Description
ARM Microcontrollers - MCU 32-bit ARM Cortex-M0 64KB Flash 12KB SRAM
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC11U35FHI33/501,

Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC11U3x
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
64 KB
Data Ram Size
12 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
HVQFN-32
Mounting Style
SMD/SMT
Factory Pack Quantity
490
NXP Semiconductors
LPC11U3X
Product data sheet
Fig 39. Reflow soldering for the TFBGA48 package
Footprint information for reflow soldering of TFBGA48 package
DIMENSIONS in mm
0.50
P
0.225
SL
0.275
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
SP
Hy
0.325
SR
P
4.75
Hx
4.75
Hy
All information provided in this document is subject to legal disclaimers.
P
Rev. 1 — 20 April 2012
Hx
32-bit ARM Cortex-M0 microcontroller
detail X
SR
SL
SP
see detail X
LPC11U3x
© NXP B.V. 2012. All rights reserved.
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