H55S1G22MFP-60 HYNIX [Hynix Semiconductor], H55S1G22MFP-60 Datasheet - Page 27

• Manufacturer Part Number: H55S1G22MFP-60
• Description: 1Gb (32Mx32bit) Mobile SDRAM
• Manufacturer: HYNIX [Hynix Semiconductor]

READ / WRITE COMMAND
Before executing a read or write operation, the corresponding bank and the row address must be activated by the
bank active (ACT) command. An interval of tRCD is required between the bank active command input and the follow-
ing read/write command input.
The READ command is used to initiate a Burst Read to an active row. The value of BA0 and BA1 selects the bank and
address inputs select the starting column location.
The value of A10 determines whether or not auto precharge is used. If auto-precharge is selected, the row being
accessed will be precharged at the end of the read burst; if auto precharge is not selected, the row will remain open
for subsequent access. The valid data-out elements will be available CAS latency after the READ command is issued.
The WRITE command is used to initiate a Burst Write access to an active row. The value of BA0, BA1 selects the bank
and address inputs select the starting column location.
The value of A10 determines whether or not auto precharge is used. If auto-precharge is selected, the row being
accessed will be precharged at the end of the write burst; if auto precharge is not selected, the row will remain open
for subsequent access.
When READ or WRITE command issues, the A0~A8 (column address) are provided if only 2KBytes page size as shown
below figure. If the page size is 4KBytes, the A0~A9 (column address) are provided.
Rev 1.2 / Jun. 2008
C L K
C K E
C S
R A S
C A S
W E
A 0 ~ A 8
A 1 0
B A 0 ,1
(H ig h )
R e a d C o m m a n d
O p e ra tio n
B A
C A
READ / WRITE COMMAND
H ig h to E n a b le
A u to P re ch a rg e
L o w to D isa b le
A u to P re ch a rg e
D o n 't C a re
1Gbit (32Mx32bit) Mobile SDR Memory
C L K
C K E
C S
R A S
C A S
W E
A 0 ~ A 8
A 1 0
B A 0 ,1
(H ig h )
W rite C o m m a n d
H55S1G(2/3)2MFP Series
O p e ra tio n
B A
C A
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