K4H281638L-LCB3 SAMSUNG [Samsung semiconductor], K4H281638L-LCB3 Datasheet - Page 23

• Manufacturer Part Number: K4H281638L-LCB3
• Description: 128Mb L-die DDR SDRAM Specification
• Manufacturer: SAMSUNG [Samsung semiconductor]

K4H281638L
The following specification parameters are required in systems using DDR400 and DDR333 devices to ensure proper system perfor-
mance. these characteristics are for system simulation purposes and are guaranteed by design.
Table 1 : Input Slew Rate for DQ, DQS, and DM
Table 2 : Input Setup & Hold Time Derating for Slew Rate
Table 3 : Input/Output Setup & Hold Time Derating for Slew Rate
Table 4 : Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate
Table 5 : Output Slew Rate Characteristice (X4, X8 Devices only)
Table 6 : Output Slew Rate Characteristice (X16 Devices only)
Table 7 : Output Slew Rate Matching Ratio Characteristics
21.0 System Characteristics for DDR SDRAM
PARAMETER
DQ/DM/DQS input slew rate measured between
V
PARAMETER
Output Slew Rate Matching Ratio (Pullup to Pulldown)
IH
Slew Rate Characteristic
Slew Rate Characteristic
(DC), V
Input Slew Rate
Input Slew Rate
Delta Slew Rate
+/- 0.25 V/ns
+/- 0.0 V/ns
+/- 0.5 V/ns
Pullup Slew Rate
Pullup Slew Rate
0.5 V/ns
0.4 V/ns
0.3 V/ns
0.5 V/ns
0.4 V/ns
0.3 V/ns
Pulldown slew
Pulldown slew
IL
(DC) and V
AC CHARACTERISTICS
AC CHARACTERISTICS
IL
(DC), V
+100
∆tDS
+150
∆tDS
+100
∆tIS
+50
+75
+50
0
0
0
IH
Typical Range
Typical Range
(DC)
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
(V/ns)
(V/ns)
∆tDH
∆tDH
+150
+100
∆tIH
+75
+50
0
0
0
0
0
Minimum
Minimum
(V/ns)
(V/ns)
1.0
1.0
0.7
0.7
SYMBOL
DCSLEW
MIN
0.67
DDR400
Units
Units
Units
ps
ps
ps
ps
ps
ps
ps
ps
ps
Maximum
Maximum
MAX
1.5
MIN
23 of 32
(V/ns)
(V/ns)
0.5
4.5
4.5
5.0
5.0
DDR400
Notes
Notes
Notes
0.67
MIN
MAX
4.0
k
k
k
i
i
i
j
j
j
DDR333
a,c,d,f,g,h
b,c,d,f,g,h
a,c,d,f,g,h
b,c,d,f,g,h
Notes
Notes
MAX
1.5
MIN
0.5
DDR333
MAX
4.0
Notes
e, l
Units
V/ns
Rev. 1.2 Feburary 2009
DDR SDRAM
Notes
a, l