K4H281638L-LCB3 SAMSUNG [Samsung semiconductor], K4H281638L-LCB3 Datasheet - Page 2

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K4H281638L-LCB3

Manufacturer Part Number
K4H281638L-LCB3
Description
128Mb L-die DDR SDRAM Specification
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
Table of Contents
1.0 Key Features ...............................................................................................................................4
2.0 Ordering Information ..................................................................................................................4
3.0 Operating Frequencies ...............................................................................................................4
4.0 Pin / Ball Description ..................................................................................................................5
5.0 Package Physical Dimension ....................................................................................................7
6.0 Block Diagram (2Mb x 16 I/O x4 Banks) ....................................................................................9
7.0 FUNCTIONAL DESCRIPTION ....................................................................................................10
8.0 Input/Output Function Description .........................................................................................14
9.0 Command Truth Table ..............................................................................................................15
10.0 General Description ................................................................................................................16
11.0 Absolute Maximum Rating .....................................................................................................16
12.0 DC Operating Conditions .......................................................................................................16
13.0 DDR SDRAM Spec Items & Test Conditions ........................................................................17
14.0 Input/Output Capacitance ......................................................................................................17
15.0 Detailed test condition for DDR SDRAM IDD1 & IDD7A ......................................................18
16.0 DDR SDRAM IDD spec table ..................................................................................................19
17.0 AC Operating Conditions .......................................................................................................20
18.0 AC Overshoot/Undershoot specification for Address and Control Pins ...........................20
19.0 Overshoot/Undershoot specification for Data, Strobe and Mask Pins ..............................21
20.0 AC Timming Parameters & Specifications ...........................................................................22
21.0 System Characteristics for DDR SDRAM .............................................................................23
22.0 Component Notes ...................................................................................................................24
23.0 System Notes ..........................................................................................................................26
24.0 IBIS : I/V Characteristics for Input and Output Buffers .......................................................27
K4H281638L
7.1 Power-up & Initialization Sequence
7.2 Mode Register Definition
7.3 Extended Mode Register Set(EMRS)
............................................................................................................11
.............................................................................................10
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Rev. 1.2 Feburary 2009
DDR SDRAM

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