MT9LSDT1672G-10E MICRON [Micron Technology], MT9LSDT1672G-10E Datasheet
MT9LSDT1672G-10E
Related parts for MT9LSDT1672G-10E
MT9LSDT1672G-10E Summary of contents
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... TIME 41 V 1.5ns 0.8ns 42 CK0 1.5ns 0.8ns NOTE: Symbols in parentheses are not used on these modules but may be used 2ns 1ns for other modules in this product family. They are for reference only. 1 ADVANCE 8, 16 MEG x 72 168-PIN DIMM PIN SYMBOL PIN SYMBOL ...
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... Meg x 72 MT9LSDT872G-10E__ 8 Meg x 72 MT9LSDT1672G-13E__ 16 Meg x 72 MT9LSDT1672G-133__ 16 Meg x 72 MT9LSDT1672G-10E__ 16 Meg x 72 NOTE: All part numbers end with a two-place code (not shown), designating component and PCB revisions. Consult factory for current revision codes. Example: MT9LSDT1672G-133B1 GENERAL DESCRIPTION The MT9LSDT872 and MT9LSDT1672 are high-speed CMOS, dynamic random-access, 64MB and 128MB memories organized in a x72 configuration ...
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SPD CLOCK AND DATA CONVENTIONS Data states on the SDA line can change only during SCL LOW. SDA state changes during SCL HIGH are reserved for indicating start and stop conditions (Fig- ures 1 and 2). SPD START CONDITION All ...
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MT9LSDT872 (64MB) AND MT9LSDT1672 (128MB) RAS# CAS# CKE0 WE# A0-A11 BA0 BA1 S0#, S2# DQMB0-DQMB7 PLL CLK 10K REGE NOTE: 1. All resistor values are 10 ohms unless otherwise specified Meg x 72 PC133/PC100 Registered ...
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... LOAD MODE REGISTER command. Input Write Protect: Serial presence-detect hardware write protect. Input Serial Clock for Presence-Detect: SCL is used to synchronize the presence-detect data transfer to and from the module. Input Presence-Detect Address Inputs: These pins are used to configure the presence-detect device. Input Register Enable ...
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... Reserved for Future Use: These pins are not connected on this module but are assigned pins on other SDRAM versions. – Do Not Use: These pins are not connected on this module but are assigned pins on the compatible DRAM version MEG x 72 REGISTERED SDRAM DIMMs DESCRIPTION Micron Technology, Inc ...
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... TOTAL NUMBER OF SPD MEMORY BYTES 2 MEMORY TYPE 3 NUMBER OF ROW ADDRESSES 4 NUMBER OF COLUMN ADDRESSES 5 NUMBER OF BANKS 6 MODULE DATA WIDTH 7 MODULE DATA WIDTH (continued) 8 MODULE VOLTAGE INTERFACE LEVELS t 9 SDRAM CYCLE TIME, CK (CAS LATENCY = SDRAM ACCESS FROM CLOCK, (CAS LATENCY = 3) 11 MODULE CONFIGURATION TYPE ...
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... RESERVED 62 SPD REVISION 63 CHECKSUM FOR BYTES 0-62 64 MANUFACTURER’S JEDEC ID CODE 65-71 MANUFACTURER’S JEDEC ID CODE (CONT.) 72 MANUFACTURING LOCATION 73-90 MODULE PART NUMBER (ASCII) 91 PCB IDENTIFICATION CODE 92 IDENTIFICATION CODE (CONT.) 93 YEAR OF MANUFACTURE IN BCD 94 WEEK OF MANUFACTURE IN BCD 95-98 MODULE SERIAL NUMBER 99-125 MANUFACTURER-SPECIFIC DATA (RSVD) 126 ...
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... Internal refresh counter controls row addressing; all inputs and I/Os are “Don’t Care” except for CKE. 8. Activates or deactivates the DQs during WRITEs (zero-clock delay) and READs (two-clock delay Meg x 72 PC133/PC100 Registered SDRAM DIMMs ZM28_3.p65 – Rev. 4/00 REGISTERED SDRAM DIMMs commands and operations refer to the 64Mb, 128Mb x4, x8, x16 SDRAM datasheets. CS# RAS# CAS# WE# DQMB ...
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A11 A10 Unused Reserved Mode CAS Latency BT *Should program M11, M10 = “0, 0” to ensure compatibility with future devices. ...
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ABSOLUTE MAXIMUM RATINGS* Voltage on V Supply Relative Voltage on Inputs I/O Pins Relative to V ...................................... -1V to +4.6V SS Operating Temperature, T (ambient) ... 0°C to +70°C A Storage Temperature (plastic) .......... -55°C ...
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I SPECIFICATIONS AND CONDITIONS DD (Notes: 1- +3.3V ±0.3V) DD PARAMETER/CONDITION OPERATING CURRENT: Active Mode Burst = 2; READ or WRITE (MIN); CAS latency = 3 STANDBY CURRENT: Power-Down Mode; CKE = LOW; ...
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... AUTO REFRESH PERIOD PRECHARGE command period ACTIVE bank A to ACTIVE bank B command Transition time WRITE recovery time Exit SELF REFRESH to ACTIVE command *Specifications for the SDRAM components used on the module Meg x 72 PC133/PC100 Registered SDRAM DIMMs ZM28_3.p65 – Rev. 4/00 = +3.3V MHz. DD -13E ...
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NOTE: 1. This parameter is sampled The minimum specifications are used only to indicate cycle time at which proper operation over the full temperature range (0°C ≤ T ≤ +70°C) is ensured initial pause of ...
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AC FUNCTIONAL CHARACTERISTICS (Notes: 1-7) PARAMETER READ/WRITE command to READ/WRITE command CKE to clock disable or power-down entry mode CKE to clock enable or power-down exit setup mode DQM to input data delay DQM to data mask during WRITEs DQM ...
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SERIAL PRESENCE-DETECT EEPROM DC OPERATING CONDITIONS (Note +3.3V ±0.3V) DD PARAMETER/CONDITION SUPPLY VOLTAGE INPUT HIGH VOLTAGE: Logic 1; All inputs INPUT LOW VOLTAGE: Logic 0; All inputs OUTPUT LOW VOLTAGE 3mA OUT INPUT LEAKAGE CURRENT: ...
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SCL t SU:STA SDA IN SDA OUT SERIAL PRESENCE-DETECT EEPROM TIMING PARAMETERS SYMBOL BUF HD:DAT t HD:STA 8, 16 Meg x 72 PC133/PC100 Registered SDRAM DIMMs ZM28_3.p65 – Rev. 4/00 SPD EEPROM ...
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R (2X) .118 (3.00) (2X) .118 (3.00) .250 (6.35) PIN 1 .118 (3.00) PIN 168 NOTE: 1. All dimensions in inches (millimeters) MAX or typical where noted. 8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: ...