MC9S08SG32E1JTGR FREESCALE [Freescale Semiconductor, Inc], MC9S08SG32E1JTGR Datasheet - Page 324

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MC9S08SG32E1JTGR

Manufacturer Part Number
MC9S08SG32E1JTGR
Description
HCS08 Microcontrollers
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet
Appendix B Ordering Information and Mechanical Drawings
B.1.1
This device uses a smart numbering system. Refer to the following diagram to understand what each
element of the device number represents.
B.2
Table B-2
outline/mechanical drawings are available on the MC9S08SG32 Series Product Summary pages at
http://www.freescale.com.
To view the latest drawing, either:
324
Core
Family
- SG
Status
- S = Auto Qualified
- MC = Fully Qualified
Main Memory Type
- 9 = Flash-based
Click on the appropriate link in
Open a browser to the Freescale
document number (from
Package Information and Mechanical Drawings
provides the available package types and their document numbers. The latest package
Device Numbering Scheme
S
Figure B-1. MC9S08SG32 Device Numbering Scheme
9
Table
S08
Memory Size
- 32 Kbytes
- 16 Kbytes
MC9S08SG32 Data Sheet, Rev. 7
B-2) in the “Enter Keyword” search box at the top of the page.
Table B-2,
®
SG n
website (http://www.freescale.com), and enter the appropriate
E1
or
C
xx
R
Mask Set Identifier — this
field only appears in “Auto
Qualified” part numbers
- Alpha character references
- Numeric character identifies
Tape and Reel Suffix (optional)
- R = Tape and Reel
Temperature Option
- C = –40 to 85 °C
- V = –40 to 105 °C
- M = –40 to 125 °C
- J = –40 to 140 °C
- W = –40 to 150 °C
Package Designator
Two letter descriptor (refer to
Table
wafer fab.
mask.
B-2).
Freescale Semiconductor

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