MC9S08SG32E1JTGR FREESCALE [Freescale Semiconductor, Inc], MC9S08SG32E1JTGR Datasheet - Page 291

no-image

MC9S08SG32E1JTGR

Manufacturer Part Number
MC9S08SG32E1JTGR
Description
HCS08 Microcontrollers
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet
A.4
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take P
voltage and V
pin current (heavy loads), the difference between pin voltage and V
Freescale Semiconductor
#
1
2
3
4
C
D
D
D
Thermal Characteristics
Operating temperature range
(packaged)
Thermal resistance, Single-layer board
Thermal resistance, Four-layer board
Maximum junction temperature
SS
or V
Temperature Code W
Temperature Code J
Temperature Code M
Temperature Code V
Temperature Code C
28-pin TSSOP
20-pin TSSOP
16-pin TSSOP
28-pin TSSOP
20-pin TSSOP
16-pin TSSOP
DD
I/O
Rating
and multiply by the pin current for each I/O pin. Except in cases of unusually high
into account in power calculations, determine the difference between actual pin
Table A-3. Thermal Characteristics
MC9S08SG32 Data Sheet, Rev. 7
Symbol
θ
θ
T
T
JA
JA
A
J
Airflow @200
Airflow @200
ft/min
ft/min
108
71
94
51
68
78
–40 to 150
–40 to 140
–40 to 125
–40 to 105
–40 to 85
Value
135
155
SS
or V
Convection
Convection
Natural
Natural
114
133
DD
91
58
75
92
Appendix A Electrical Characteristics
will be very small.
°C/W
°C/W
Unit
°C
°C
Rated
Temp
291

Related parts for MC9S08SG32E1JTGR