MT48H16M32LFCJ-75 MICRON [Micron Technology], MT48H16M32LFCJ-75 Datasheet - Page 73

• Manufacturer Part Number: MT48H16M32LFCJ-75
• Description: 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
• Manufacturer: MICRON [Micron Technology]

Figure 56:
PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03
MT48H32M16LF_1.fm - Rev. H 6/07 EN
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
Micron, the M logo, the Micron logo, and Endur-IC are trademarks of Micron Technology, Inc. All other trademarks are the
Dimensions apply
to solder balls post
reflow. The pre-
reflow balls are
Ø0.42 on Ø0.40
SMD ball pads.
for production devices. Although considered final, these specifications are subject to change, as further product
11.2
Seating
90X Ø0.45
plane
0.1 A
0.8 TYP
90-Ball VFBGA (10mm x 13mm)
5.6
Notes:
A
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
9 8
1. All dimensions are in millimeters.
2. Green packaging composition is available upon request.
3.2
7
development and data characterization sometimes occur.
10 ±0.1
6.4
5 ±0.05
3 2
property of their respective owners.
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
0.8 TYP
512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
6.5 ±0.05
0.65 ±0.05
Ball A1 ID
73
13 ±0.1
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.0 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
©2005 Micron Technology, Inc. All rights reserved.
Ball A1 ID