ADF4154 Analog Devices, ADF4154 Datasheet - Page 20

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ADF4154

Manufacturer Part Number
ADF4154
Description
Fractional-n Frequency Synthesizer
Manufacturer
Analog Devices
Datasheet

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ADF4154
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADF4154BRU
ADF4154BRU-REEL
ADF4154BRU-REEL7
ADF4154BCP
ADF4154BCP-REEL
ADF4154BCP-REEL7
EVAL-ADF4154EB1
Purchase of licensed I
Philips I
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
2
C Patent Rights to use these components in an I
2
C components of Analog Devices, Inc. or one of its sublicensed Associated Companies conveys a license for the purchaser under the
Description
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
INDICATOR
SEATING
PLANE
PIN 1
1.00
0.85
0.80
0.15
0.05
D04833–0–4/04(0)
4.50
4.40
4.30
PIN 1
12° MAX
Figure 26. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
Figure 27. 20-Lead Lead Frame Chip Scale Package [LFCSP]
BSC
0.50
16
BSC SQ
1
COPLANARITY
VIEW
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
TOP
4.0
2
C system, provided that the system conforms to the I
COMPLIANT TO JEDEC STANDARDS MO-153AB
0.80 MAX
0.65 TYP
5.10
5.00
4.90
0.10
REF
0.20
Dimensions shown in millimeters
Dimensions shown in millimeters
0.30
0.19
4 mm × 4 mm Body, (CP-20)
BSC SQ
9
8
Rev. 0 | Page 20 of 20
1.20
MAX
3.75
SEATING
PLANE
BSC
6.40
0.05 MAX
0.02 NOM
(RU-16)
0.20
0.09
COPLANARITY
MAX
0.75
0.55
0.35
0.60
0.08
MAX
0.60
15
11
10
16
BOTTOM
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
VIEW
0.30
0.23
0.18
20
6
1
5
2
0.75
0.60
0.45
C Standard Specifications as defined by Philips.
0.25 MIN
2.25
2.10 SQ
1.95
Package Option
RU-16
RU-16
RU-16
CP-20
CP-20
CP-20

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