bga735l16 Infineon Technologies Corporation, bga735l16 Datasheet - Page 35

• Manufacturer Part Number: bga735l16
• Description: High Linearity Tri-band Umts Lna
• Manufacturer: Infineon Technologies Corporation

3.5
Figure 5
Figure 6
Data Sheet
Application Board
Application board layout on 3-layer FR4. Top layer thickness: 0.2 mm, bottom layer thickness:
0.8 mm, 17 m Cu metallization, gold plated. Board size: 21 x 50 mm
Cross-section view of application board
BGA735L16 - Low Power Tri-Band UMTS LNA
35
Application Circuit and Block Diagram
Application Board
V3.0, 2008-08-26