mc9s12uf32 Freescale Semiconductor, Inc, mc9s12uf32 Datasheet - Page 102

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mc9s12uf32

Manufacturer Part Number
mc9s12uf32
Description
System Chip Guide V01.05
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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System on a Chip Guide — 9S12UF32DGV1/D V01.05
102
Num C
NOTES:
1. The values for thermal resistance are achieved by package simulations
1
2
3
4
I
additionally contains the current flowing into the external loads with output high.
Which is the sum of all output currents on I/O ports associated with VDD3X, VDDX and VDDR.
DDR
T
T
T
T
is the current shown in Table A-8 and not the overall current flowing into VDDR, which
Thermal Resistance LQFP100, single layer PCB
natural convection
Thermal Resistance LQFP100, four layer PCB
natural convection
Thermal Resistance LQFP64, single layer PCB
natural convection.
Thermal Resistance LQFP64, four layer PCB natural
convection.
Table A-5 Thermal Package Characteristics
Rating
P
P INT
IO
=
=
i
I DDR V DDR
R
DSON
Symbol
JA
JA
JA
JA
I IO
i
2
Min
-
-
-
-
1
Typ
56
46
64
48
Freescale Semiconductor
Max
o
o
o
o
Unit
C/W
C/W
C/W
C/W

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