mc9s08qg4 Freescale Semiconductor, Inc, mc9s08qg4 Datasheet - Page 268

• Manufacturer Part Number: mc9s08qg4
• Description: Hcs08 Microcontrollers Microcontroller Family
• Manufacturer: Freescale Semiconductor, Inc

Appendix A Electrical Characteristics
A.3
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take P
voltage and V
pin current (heavy loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
268
T
θ
P
JA
D
A
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
Thermal Characteristics
int
SS
+ P
Operating temperature range (packaged)
Thermal resistance
Thermal resistance
or V
I/O
Single-layer board
Four-layer board
DD
I/O
and multiply by the pin current for each I/O pin. Except in cases of unusually high
8-pin PDIP
8-pin NB SOIC
8-pin DFN
16-pin PDIP
16-pin TSSOP
16-pin QFN
24-pin QFN
8-pin PDIP
8-pin NB SOIC
8-pin DFN
16-pin PDIP
16-pin TSSOP
16-pin QFN
24-pin QFN
into account in power calculations, determine the difference between actual pin
Rating
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 4
Table A-2. Thermal Characteristics
T
J
J
= T
) in °C can be obtained from:
A
+ (P
M
C
D
× θ
Symbol
JA
θ
θ
)
T
JA
JA
A
SS
–40 to 125
–40 to 85
T
or V
Value
L
113
150
179
133
132
125
78
72
87
41
53
86
36
44
to T
DD
H
will be very small.
Freescale Semiconductor
°C/W
°C/W
Unit
°C
Eqn. A-1