mc9s08rd60fj Freescale Semiconductor, Inc, mc9s08rd60fj Datasheet - Page 227

• Manufacturer Part Number: mc9s08rd60fj
• Description: Hcs08 Microcontrollers
• Manufacturer: Freescale Semiconductor, Inc

D.2.3 32-Pin LQFP Package Drawing
Freescale Semiconductor
SEATING
PLANE
9
B
C
B1
-AB-
-AC-
E
-T-
H
8
1
8X
xxxxxx xxxxxx
M
32
W
9
DETAIL AD
S1
A1
G
x
x x
x x
x
xx x x
A
S
0.10 (0.004) AC
DETAIL Y
X
-Z-
25
K
R
4X
17
4X
Q
0.20 (0.008)
0.20 (0.008)
-U-
MC9S08RC/RD/RE/RG
V1
DETAIL AD
V
CASE 873A-02
AB
ISSUE A
AC
T-U
F
SECTION AE-AE
T-U
METAL
xxx
xxx
xxx
xxx
xxx
xxx
BASE
Z
J
N
Z
D
SoC Guide — MC9S08RG60/D Rev 1.10
P
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLANE -AB- IS LOCATED AT BOTTOM OF LEAD
AND IS COINCIDENT WITH THE LEAD WHERE THE
LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF
THE PARTING LINE.
DATUMS -T-, -U-, AND -Z- TO BE DETERMINED AT
DATUM PLANE -AB-.
DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -AC-.
DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.250
(0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE DETERMINED AT DATUM
PLANE -AB-.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.520 (0.020).
MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
EXACT SHAPE OF EACH CORNER MAY VARY FROM
DEPICTION.
DIM
A1
B1
S1
V1
M
W
A
B
C
D
E
F
G
H
J
K
N
P
Q
R
S
V
X
1.400
0.300
1.350
0.300
0.050
0.090
0.500
0.090
0.150
MILLIMETERS
MIN
0.800 BSC
0.400 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.200 REF
1.000 REF
1
12 REF
DETAIL Y
_
_
1.600
0.450
1.450
0.400
0.150
0.200
0.700
0.160
0.250
MAX
5
_
0.055
0.012
0.053
0.012
0.002
0.004
0.020
0.004
0.006
MIN
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.031 BSC
0.016 BSC
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
1
12 REF
INCHES
_
_
AE
AE
DATE 12/16/93
0.063
0.018
0.057
0.016
0.006
0.008
0.028
0.006
0.010
MAX
5
_
227