pic24hj12gp202 Microchip Technology Inc., pic24hj12gp202 Datasheet - Page 222

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pic24hj12gp202

Manufacturer Part Number
pic24hj12gp202
Description
High-performance, 16-bit Digital Signal Controllers
Manufacturer
Microchip Technology Inc.
Datasheet

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PIC24HJ12GP201/202
DS70282B-page 220
18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
N
1
2 3
b
D
Dimension Limits
Preliminary
e
α
E1
A2
E
Units
A2
A1
E1
L1
N
D
A
E
α
e
h
L
φ
c
b
β
φ
MIN
2.05
0.10
0.25
0.40
0.20
0.31
L
h
L1
MILLIMETERS
10.30 BSC
11.55 BSC
1.27 BSC
7.50 BSC
1.40 REF
NOM
18
Microchip Technology Drawing C04-051B
h
© 2007 Microchip Technology Inc.
β
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
c

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