mpc8347ecvvalf Freescale Semiconductor, Inc, mpc8347ecvvalf Datasheet - Page 57

• Manufacturer Part Number: mpc8347ecvvalf
• Description: Mpc8347e Powerquicc Ii Pro Family
• Manufacturer: Freescale Semiconductor, Inc

18.3
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm,
620 plastic ball grid array (PBGA).
Freescale Semiconductor
Package outline
Interconnects
Pitch
Module height (maximum)
Module height (typical)
Module height (minimum)
Solder Balls
Ball diameter (typical)
Package Parameters for the MPC8347E PBGA
MPC8347E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 10
29 mm × 29 mm
1.00 mm
2.46 mm
2.23 mm
2.00 mm
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
620
0.60 mm
Package and Pin Listings
57