mpc8347ecvvalf Freescale Semiconductor, Inc, mpc8347ecvvalf Datasheet - Page 55

• Manufacturer Part Number: mpc8347ecvvalf
• Description: Mpc8347e Powerquicc Ii Pro Family
• Manufacturer: Freescale Semiconductor, Inc

18 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8347E is available in
two packages—a tape ball grid array (TBGA) and a plastic ball grid array (PBGA). See
“Package Parameters for the MPC8347E TBGA,” Section 18.2, “Mechanical Dimensions for the
MPC8347E TBGA,” Section 18.3, “Package Parameters for the MPC8347E PBGA,”
“Mechanical Dimensions for the MPC8347E PBGA.”
18.1
The package parameters are provided in the following list. The package type is 35 mm × 35 mm, 672 tape
ball grid array (TBGA).
Freescale Semiconductor
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
Package Parameters for the MPC8347E TBGA
MPC8347E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 10
35 mm × 35 mm
672
1.00 mm
1.46 mm
62 Sn/36 Pb/2 Ag (ZU package)
95.5 Sn/0.5 Cu/4Ag (VV package)
0.64 mm
Package and Pin Listings
and
Section 18.1,
Section 18.4,
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