MT29F16G08FAAWC Micron, MT29F16G08FAAWC Datasheet - Page 79

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MT29F16G08FAAWC

Manufacturer Part Number
MT29F16G08FAAWC
Description
NAND Flash Memory; Density: 16Gb; Organization: 2Gbx8; Bits/Cell: SLC; I/O: Common; Supply Voltage: 3.3V; Operating Temperature Range: 0° to +70°C; Package: 48-TSOP
Manufacturer
Micron
Datasheet

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Quantity
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Part Number:
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Package Dimensions
Figure 76:
PDF: 09005aef81b80e13/Source: 09005aef81b80eac
4gb_nand_m40a__2.fm - Rev. B 2/07 EN
12.00 ±0.08
24
1
0.15
+0.03
-0.02
48-Pin TSOP Type 1 (WP Package Code)
Note:
All dimensions are in millimeters.
20.00 ±0.25
18.40 ±0.08
See detail A
79
4Gb, 8Gb, and 16Gb x8 NAND Flash Memory
1.20 MAX
Micron Technology, Inc., reserves the right to change products or specifications without notice.
48
25
0.25
for reference only
0.50 TYP
for reference
only
0.10
0.10
+0.10
-0.05
Package Dimensions
©2006 Micron Technology, Inc. All rights reserved.
Package width and length
do not include mold
protrusion. Allowable
protrusion is 0.25 per side.
Mold compound:
Plated lead finish:
Detail A
Epoxy novolac
100% Sn
0.27 MAX
0.17 MIN
0.50 ±0.1
0.80
0.25
Gage
plane

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