DT28F016SV-080 Intel Corporation, DT28F016SV-080 Datasheet - Page 9

• Manufacturer Part Number: DT28F016SV-080
• Description: 16-MBIT (1 MBIT x 16/ 2 MBIT x 8) FlashFile MEMORY
• Manufacturer: Intel Corporation

E
order address and address A
care). A device block diagram is shown in Figure
1.
The 28F016SV is specified for a maximum access
time of 65 ns (t
5.25V) over the commercial temperature range
(0 C to +70 C). A corresponding maximum access
time of 75 ns at 3.3V (3.0V to 3.6V and 0 C to
+70 C)
consumption applications.
The 28F016SV incorporates an Automatic Power
Saving (APS) feature, which substantially reduces
the active current when the device is in static
mode of operation (addresses not switching). In
APS mode, the typical I
(3.0 mA at 3.3V).
A deep power-down mode of operation is invoked
when the RP# (called PWD# on the 28F008SA)
pin transitions low. This mode brings the device
power consumption to less than 2.0 µA, typically,
and provides additional program protection by
acting as a device reset pin during power
transitions. A reset time of 400 ns (5V V
is
achieved
ACC
) at 5V operation (4.75V to
CC
for
current is 1 mA at 5V
0
is not used (don’t
reduced
power
CC
operation) is required from RP# switching high
until outputs are again valid. In the Deep Power-
Down state, the WSM is reset (any current
operation will abort) and the CSR, GSR and BSR
registers are cleared.
A CMOS standby mode of operation is enabled
when either CE
RP# stays high with all input control pins at CMOS
levels. In this mode, the device typically draws an
I
The 28F016SV will be available in 56-lead,
1.2 mm thick, 14 mm x 20 mm TSOP and 56-lead,
1.8 mm thick, 16 mm x 23.7 SSOP Type I
packages. The form factor and pinout of these two
packages allow for very high board layout
densities.
2.0 DEVICE PINOUT
The 28F016SV 56-lead TSOP and 56-lead SSOP
Type I pinout configurations are shown in Figures
2 and 3.
CC
standby current of 70 µA at 5V V
28F016SV FlashFile™ MEMORY
0
# or CE
1
# transitions high and
CC
.
9