SCAN18245TSSCX Fairchild Semiconductor, SCAN18245TSSCX Datasheet

SCAN18245TSSCX

Manufacturer Part Number

SCAN18245TSSCX

Description

IC TRANSCVR 3ST NON-INV 56SSOP

Manufacturer

Fairchild Semiconductor

Series

SCANr

Datasheet

1.SCAN18245TSSC.pdf (11 pages)

Specifications of SCAN18245TSSCX

Logic Type

Transceiver, Non-Inverting

Number Of Elements

Number Of Bits Per Element

Current - Output High, Low

32mA, 64mA

Voltage - Supply

4.5 V ~ 5.5 V

Operating Temperature

-40°C ~ 85°C

Mounting Type

Surface Mount

Package / Case

56-SSOP

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Meier Automation Equipment Co., Limited

Part Number:

SCAN18245TSSCX

Manufacturer:

FAIRCHILD/仙童

Quantity:

20 000

Current page: 1 of 5
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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

Updated process quality documentation, such as FMEAs and Control Plans, are available for

viewing upon request.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Khoo, EC

E-mail: EC.Khoo@fairchildsemi.com

Phone: 604-6437211 ext. 2452

Implementation of change:

Expected 1st Device Shipment Date: 2008/12/07

Earliest Year/Work Week of Changed Product: 0850

Change Type Description: Die Attach Material, Mold Compound

Description of Change (From): SSOP-48 & -56 lead packages assemble with Sumitomo

non-green mold compound, EME-6700 and Ablestik die-attach epoxy, JM-2000LB as shown in

Table 1.

Description of Change (To): SSOP-48 & -56 lead packages assemble with Sumitomo green

mold compound, EME-G630M and die-attach epoxy, CRM-1064L as shown in Table 2.

Reason for Change : Sumitomo Bakelite had discontinued production of EME-6700 mold

compound since March 2008 and Ablestik will discontinue production of die-attach epoxy

JM-2000LB in January 2009. Replace non-green by green (Halogen-free Flame Retardant)

mold compound is to align with the Green Initiative by Fairchild Semiconductor and is

dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level

interconnect lead-free and RoHS compliance.The reference material changes have been made to

provide a 'full green' package. For additional details on the corporate wide Green Initiative,

please visit our Web site: http://www.fairchildsemi.com/company/green/index.html

Manufacturing will occur at the same assembly facility producing the current non-green

products. Package outline drawings of the affected products remain unchanged. Green products

will be fully compliant to all published data sheet specifications. Quality and reliability will

remain at the highest standards already demonstrated with existing products.

Qual/REL Plan Numbers : Q20070484

Qualification :

DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL

Technical Contact:

Name: Lee, Chan Shyong

E-mail: Chan.Shyong.Lee@fairchildsemi.com

Phone: 604-6437211 ext. 2645

Date Issued On : 2008/09/10

Date Created : 2008/09/01

PCN# : Q3083601

Pg. 1

Related parts for SCAN18245TSSCX

SCAN18245TSSCX Summary of contents

Page 1

... JM-2000LB in January 2009. Replace non-green by green (Halogen-free Flame Retardant) mold compound is to align with the Green Initiative by Fairchild Semiconductor and is dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level interconnect lead-free and RoHS compliance.The reference material changes have been made to provide a 'full green' package ...

Page 2

... All reliability tests outlined in Q20070484 qualification plan were successfully completed with no failure detected and meet the requirements for release. As such, SSOP-48 & -56 lead packages manufacture in Fairchild Semiconductor Malaysia are qualified to be assembled with die-attach epoxy CRM-1064L and green mold compound EME-G630M. ...

Page 3

Q20070484CAGATE+ GTLP18T612MEA Q20070484CBGATE+ GTLP18T612MEA Test: (High Temperature Storage Life) Lot Device Q20070484AAHTSL 74LVTH16501MEA Q20070484ABHTSL Q20070484BAHTSL 74ABT16543CSSC Q20070484BBHTSL Q20070484CAHTSL GTLP18T612MEA Q20070484CBHTSL Test: (Static Op Life) Lot Device Q20070484AASOPL1 74LVTH16501MEA Q20070484ABSOPL1 Q20070484BASOPL1 74ABT16543CSSC Q20070484BBSOPL1 Q20070484CASOPL1 GTLP18T612MEA Q20070484CBSOPL1 Test: -65C, 150C (Temperature Cycle) ...

Page 4

... GTLP16617MEAX SCAN18245TSSCX SCAN18373TSSC 0/353 0/353 0/353 0/353 0/353 0/353 74ABT16244CSSC 74ABT16374CSSCX 74ABT16500CSSC 74ABT16652CSSCX 74ACT16244SSC 74ACT16373SSCX 74ACT16646SSC 74ACTQ16245SSCX 74ACTQ16373SSC 74ACTQ16541SSCX 74ACTQ16646SSC 74LCX162373MEAX 74LCX162374MEA ...

Page 5

SCAN18541TSSCX SCAN18541TSSC Pg. 5 ...

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