MT92220BG Zarlink Semiconductor, MT92220BG Datasheet - Page 210

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MT92220BG

Manufacturer Part Number
MT92220BG
Description
Description = 1023 Channel Voice Over IP/AAL2 Processor ;; Package Type = Epbga ;; No. Of Pins = 608
Manufacturer
Zarlink Semiconductor
Datasheet
MT92220
Data Sheet
LANE (L ocal A rea N etwork E mulation ): LANE is a method for emulating Ethernet behavior over ATM AAL5. It
takes over the behavior of the MAC layer in Ethernet networks.
LI (L ength I ndicator ): The LI in an AAL2 mini-packet is a 6-bit field that indicates the number of payload bytes within
the mini-packet. LI = 00h means 1 payload byte, LI = 3Fh means 64 payload bytes.
LLC (L ogical L ink C ontrol ): The LLC method allows multiplexing of multiple protocols over a single ATM VC. LLC
headers are 3 bytes.
MAC (M edia A ccess C ontrol ): The MAC layer is concerned with the control of access to a medium shared between
two or more entities. It is a control layer for Ethernet.
OC-3 (O ptical C arrier level- 3): A SONET channel that carries a bandwidth of 155.55 Mbps.
Packet: The "data" unit carried on a link layer. A packet, on an IP network, consists of an entire IP datagram or a
fragment of a datagram.
PCM (P ulse C ode M odulation ): PCM is the basic method of encoding an analog voice signal into digital form using
8-bit samples. Defined by the ITU standard G.711.
PHY (PHY sical layer )
PLL (P hase L ock L oop ): A phase lock loop is a component that generates an output clock by synchronizing itself to
an input clock. PLLs are often used to multiply the frequency of clocks.
POS (P acket O ver SONET): A means of transporting packets over a SONET link with minimal overhead in a
point-to-point connection. POS uses PPP as its link protocol.
POS-PHY : A bus standard for connecting P acket O ver SONET link layer devices to PHY sical layer ones. POS-PHY
level 2 was based loosely on UTOPIA level 2.
POTS (P lain O ld T elephone S ervice ): The ubiquitous, 64 kbps phone service widely deployed in today's phone
networks.
PPP (P oint-to- P oint P rotocol ): A link protocol that allows for transport of many network protocols over a
point-to-point link. PPP has very little overhead (1 or 2 bytes per packet), making it very attractive for some
applications.
RAM (R andom A ccess M emory ): RAM is the main memory in the computer. It is called “random” because any
random address can be accessed in an equal amount of time.
RTCP (R eal- T ime C ontrol P rotocol ): The control protocol for RTP, RTCP is used for control and diagnostic on RTP
sessions. Like RTP, RTCP typically runs on top of UDP and is defined in the IETF RFC1889.
RTP (R eal- T ime P rotocol ): A transport protocol designed to provide end-to-end delivery services for data with
real-time characteristics. RTP typically runs on top of UDP. Defined in the IETF RFC1889.
SID (S ilent I nsertion D escriptor ): A SID mini-packet is an AAL2 mini-packet containing a single byte of payload that
is inserted when a valid mini-packet has been suppressed because it was silent. The payload byte indicates the
energy level of the voice that was suppressed.
SNAP (S ub N etwork A ccess P rotocol ): A SNAP header consists of 5 bytes, three bytes of OUI (Organizationally
Unique Identifier) and 2 bytes of PID (Protocol IDentifier). The OUI defines which organization administers the PID
that follows. The value of 000000h in the OUI means that the PID is defined as an EtherType.
TCP (T ransmission C ontrol P rotocol ): A transport layer, TCP is a highly reliable host-to-host protocol that
guarantees packet delivery, non-duplicated and in order. TCP runs on top of IP. Defined in IETF RFC791 & STD7.
TDM (T ime D ivision M ultiplexing ): TDM busses carry voice data divided according to frames. In a single 125 us
frame, the TDM bus will have carried one byte from each channel it contains.
UDP (U ser D atagram P rotocol ): A transport layer, UDP provides a protocol for applications to communicate with a
minimum of overhead. UDP does not guarantee packet delivery or ordering. UDP runs on top of IP. Defined in IETF
RFC768 & STD6.
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Zarlink Semiconductor Inc.

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