MT55L1MY18P Micron Semiconductor Products, Inc., MT55L1MY18P Datasheet - Page 9

• Manufacturer Part Number: MT55L1MY18P
• Description: 18Mb ZBT SRAM, 3.3V Vdd, 2.5V or 3.3V I/O; 2.5V Vdd, 2.5V I/O, Pipelined,
• Manufacturer: Micron Semiconductor Products, Inc.

Table 2:
18Mb: 1 Meg x 18, 512K x 32/36 Pipelined ZBT SRAM
MT55L1MY18P_16_D.fm – Rev. D, Pub. 2/03
SYMBOL
NF/DQPa
NF/DQPb
NF/DQPd
NF/DQPc
V
TDO
V
V
NC
DD
NF
DD
SS
Q
FBGA Ball Descriptions (continued)
Output
Supply
Supply
Supply
TYPE
I/O
NF
–
–
No Function/Parity Data I/Os: On the x32 version, these are No Function (NF). On the x18
version, byte “a” parity is DQPa; byte “b” parity is DQPb. On the x36 version, byte “a” parity
is DQPa; byte “b” parity is DQPb; byte “c” parity is DQPc; byte “d” parity is DQPd.
IEEE 1149.1 Test Output: JEDEC-standard 3.3V and 2.5V I/O levels.
Power Supply: See DC Electrical Characteristics and Operating Conditions for range.
Isolated Output Buffer Supply: See DC Electrical Characteristics and Operating Conditions for
range.
Ground: GND.
No Connect: These balls are not internally connected to the die. They may be left floating,
driven by signals, or connected to ground to improve package heat dissipation.
No Function: These balls are internally connected to the die and have the capacitance of an
input ball. They may be left floating, driven by signals, or connected to ground to improve
package heat dissipation.
9
18Mb: 1 MEG x 18, 512K x 32/36
DESCRIPTION
Micron Technology, Inc., reserves the right to change products or specifications without notice.
PIPELINED ZBT SRAM
©2003 Micron Technology, Inc.