MT55L128L32P1 Micron Semiconductor Products, Inc., MT55L128L32P1 Datasheet
MT55L128L32P1
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MT55L128L32P1 Summary of contents
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... Industrial (-40°C to +85°C)** Part Number Example: MT55L256L18P1T-10 4Mb: 256K x 18, 128K x 32/36 Pipelined ZBT SRAM MT55L256L18P1_F.p65 – Rev. F, Pub. 1/03 EN PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE. 4Mb: 256K x 18, 128K x 32/36 MT55L256L18P1, MT55L256V18P1, MT55L128L32P1, MT55L128V32P1, MT55L128L36P1, MT55L128V36P1 3. MARKING -6 NOTE: 1 ...
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SA0, SA1, SA MODE CLK K CKE# WRITE ADDRESS REGISTER 1 ADV/LD# BWa# BWb# R/W# OE# CE# CE2 CE2# 17 SA0, SA1, SA MODE CLK K CKE# WRITE ADDRESS REGISTER 1 ADV/LD# BWa# BWb# BWc# BWd# R/W# OE# CE# ...
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GENERAL DESCRIPTION (continued) The synchronous inputs include all addresses, all data inputs, chip enable (CE#), two additional chip enables for easy depth expansion (CE2, CE2#), cycle start input (ADV/LD#), synchronous clock enable (CKE#), byte write enables (BWa#, BWb#, BWc#, and ...
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TQFP PIN ASSIGNMENT TABLE PIN# x18 x32 x36 PIN# x18 DQc DQc DQc DQc DQc DQc DQc 31 ...
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NF** 83 NF** 84 ADV/LD# 85 OE# (G#) 86 CKE# 87 R/W# 88 CLK CE2# 92 BWa# 93 BWb CE2 97 CE ...
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TQFP PIN DESCRIPTIONS x18 x32/x36 32–35, 44–50, 32–35, 44–50, 80–82, 99, 100 81, 82, 99, 100 – 95 – ...
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TQFP PIN DESCRIPTIONS (continued) x18 x32/x36 88 88 (a) 58, 59, 62, (a) 52, 53, 63, 68, 69, 56–59, 62, 63 72–74 ( 12, 13, (b) 68, 69, 18, 19, 22–24 72–75, 78 6–9, ...
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CE# BWb# NC CE2# CKE CE2 NC BWa# CLK R/ ...
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FBGA PIN DESCRIPTIONS x18 x32/x36 SYMBOL 2A, 2B, 3P, 3R, 2A, 2B, 3P, 3R, 4P, 4R, 8P, 8R, 4P, 4R, 8P, 8R, 9P, 9R, 10A, 9P, 9R, 10A, 10B, 10P, 10B, 10P, 10R, 11A, 11R 10R, ...
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FBGA PIN DESCRIPTIONS (continued) x18 x32/x36 SYMBOL 8A 8A ADV/LD# Input Synchronous Address Advance/Load: When HIGH, this input MODE (LB0#) (a) 10J, 10K, (a) 10J, 10K, 10L, 10M, 11D, 10L, 10M, 11J, 11E, 11F, 11G 11K, 11L, ...
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FBGA PIN DESCRIPTIONS (continued) x18 x32/x36 SYMBOL 4C, 4N, 5C, 4C, 4N, 5C, 5D, 5E 5F, 5D, 5E 5F, 5G, 5H, 5J, 5G, 5H, 5J, 5K, 5L, 5M, 5K, 5L, 5M, 6C, 6D, 6E, 6F, 6C, 6D, 6E, 6F, 6G, ...
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INTERLEAVED BURST ADDRESS TABLE (MODE = NC OR HIGH) FIRST ADDRESS (EXTERNAL) SECOND ADDRESS (INTERNAL) X...X00 X...X01 X...X10 X...X11 LINEAR BURST ADDRESS TABLE (MODE = LOW) FIRST ADDRESS (EXTERNAL) SECOND ADDRESS (INTERNAL) X...X00 X...X01 X...X10 X...X11 PARTIAL TRUTH TABLE FOR ...
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DS BEGIN READ READ READ BURST BURST READ KEY: COMMAND DS READ WRITE BURST NOTE STALL or IGNORE CLOCK EDGE cycle is not shown in the above diagram. This is because CKE# HIGH only blocks the clock (CLK) ...
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TRUTH TABLE (Notes 5–10) OPERATION DESELECT Cycle DESELECT Cycle DESELECT Cycle CONTINUE DESELECT Cycle READ Cycle (Begin Burst) READ Cycle (Continue Burst) NOP/DUMMY READ (Begin Burst) DUMMY READ (Continue Burst) WRITE Cycle (Begin Burst) WRITE Cycle (Continue Burst) NOP/WRITE ABORT ...
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ABSOLUTE MAXIMUM RATINGS* Voltage on V Supply DD Relative to V .................................... -0.5V to +4.6V SS Voltage Supply DD Relative to V ........................................ -0. .................................................. -0. Storage Temperature (plastic) ........... ...
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I/O DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS (0°C ≤ T ≤ +70° +3.3V ±0.165V DESCRIPTION Input High (Logic 1) Voltage Input Low (Logic 0) Voltage Input Leakage Current Output Leakage Current Output High Voltage ...
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I OPERATING CONDITIONS AND MAXIMUM LIMITS DD (Note 1) (0°C ≤ T ≤ +70° DESCRIPTION CONDITIONS Device selected; All inputs ≤ V Power Supply or ≥ Cycle time ≥ Current: IH Operating V = MAX; ...
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TQFP THERMAL RESISTANCE DESCRIPTION Thermal Resistance Test conditions follow standard test methods (Junction to Ambient) Thermal Resistance (Junction to Top of Case) FBGA THERMAL RESISTANCE DESCRIPTION Junction to Ambient Test conditions follow standard test methods (Airflow of 1m/s) Junction to ...
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AC ELECTRICAL CHARACTERISTICS (Notes (0°C ≤ T ≤ +70° DESCRIPTION SYMBOL Clock t Clock cycle time KHKH Clock frequency t Clock HIGH time KHKL t Clock LOW time KLKH Output Times t Clock to output ...
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I/O AC TEST CONDITIONS Input pulse levels ................................... V Input rise and fall times ..................................... 1ns Input timing reference levels .......................... 1.5V Output reference levels ................................... 1.5V Output load ............................. See Figures 1 and 2 3.3V I/O Output Load ...
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SNOOZE MODE SNOOZE MODE is a low-current, “power-down” mode in which the device is deselected and current is reduced The duration of SNOOZE MODE dictated by the length of time the ZZ pin is ...
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KHKH CLK EVKH KHEX KHKL CKE CVKH KHCX CE# ADV/LD# R/W# BWx ADDRESS t t AVKH KHAX DQ OE# COMMAND WRITE WRITE D(A1) D(A2) READ/WRITE TIMING PARAMETERS -6 -7.5 SYM ...
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CLK CKE# CE# ADV/LD# R/W# BWx ADDRESS DQ COMMAND WRITE READ D(A1) Q(A2) NOP, STALL, AND DESELECT TIMING PARAMETERS -6 -7.5 SYM MIN MAX MIN MAX t KHQX 1.5 1.5 t KHQZ 1.5 3.5 1.5 3.5 ...
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TYP +0.06 0.32 -0.10 PIN #1 ID NOTE: 1. All dimensions in millimeters MAX or typical where noted. 2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per ...
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BALL A11 165X Ø 0.45 SOLDER BALL DIAMETER REFERS TO POST REFLOW CONDITION. THE PRE-REFLOW DIAMETER IS Ø 0.40 7.50 ±0.05 15.00 ±0.10 7.00 ±0.05 NOTE: 1. All dimensions in millimeters MAX or typical where noted. DATA SHEET ...
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REVISION HISTORY Updated package drawings ................................................................................................................................... January 9/03 Removed “Preliminary Package Data” from front page .............................................................................. February 22/02 Removed 119-pin PBGA package and references ........................................................................................ February 14/02 Removed note “Not Recommended for New Designs,” Rev. 6/01 ...................................................................... June 7/01 Added ...