MT28C3212P2 Micron Semiconductor Products, Inc., MT28C3212P2 Datasheet - Page 46

• Manufacturer Part Number: MT28C3212P2
• Description: 2 Meg X 16 Page Flash, 128K X 16 SRAM Combo Memory, 66-ball Fbga
• Manufacturer: Micron Semiconductor Products, Inc.

NOTE: 1. All dimensions in millimeters MAX or typical where noted.
DATA SHEET DESIGNATION
This data sheet contains minimum and maximum limits specified over the complete power supply and
temperature range for production devices. Although considered final, these specifications are subject to change,
as further product development and data characterization sometimes occur.
2 Meg x 16 Page Flash 128K x 16 SRAM Combo Memory
MT28C3212P2FL_2.p65 – Rev. 2, Pub. 4/02
SEATING PLANE
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø 0.33
0.10
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.27mm per side.
66X Ø 0.35
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
C
5.60
Micron is a registered trademark and the Micron logo and M logo are trademarks of Micron Technology, Inc.
2.80 ±0.05
1.05 ±0.075
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
4.40 ±0.05
BALL A12
12.00 ±0.10
8.80
C L
(TYP)
MIN
0.80
6.00 ±0.05
66-BALL FBGA
C L
BALL A1
BALL #1 ID
4.00 ±0.05
46
128K x 16 SRAM COMBO MEMORY
(TYP)
0.80
8.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.40 MAX
2 MEG x 16 PAGE FLASH
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: Ø .27mm
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
BALL A1
©2002, Micron Technology, Inc.