BUW12AW NXP Semiconductors, BUW12AW Datasheet - Page 10

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BUW12AW

Manufacturer Part Number
BUW12AW
Description
Silicon Diffused Power Transistors
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
PACKAGE OUTLINE
1997 Aug 14
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-247
Silicon diffused power transistors
Note
1. Terminals are uncontrolled within zone L 1 .
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT429
5.3
4.7
A
1.9
1.7
A 1
1.2
0.9
b
L 1
R
(1)
2.2
1.8
b 1
IEC
3.2
2.8
b 2
b 2
1
e
0.9
0.6
c
E
P
TO-247
2
JEDEC
b 1
b
21
20
e
D
REFERENCES
16
15
E
3
0
5.45
e
w
q
M
scale
EIAJ
S
16
15
10
9
L
Y
4.0
3.6
L 1
20 mm
D
L
3.7
3.3
P
2.6
2.4
Q
A 1
5.3
q
BUW12W; BUW12AW
Q
3.5
3.3
R
PROJECTION
EUROPEAN
A
7.5
7.1
c
S
0.4
w
Product specification
15.7
15.3
Y
ISSUE DATE
97-06-11
6
4
SOT429
17
13

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